System and method for modeling thermal circuits

1. A method for modeling a thermal circuit of a power inverter, the method comprising:

setting a first input node of the thermal circuit to a first measured temperature;

setting a second input node of the thermal circuit to a second measured temperature;

determining at least one thermal characteristic of the thermal circuit using, at least, the first measured temperature and the second measured temperature; and

determining an operating temperature of the thermal circuit based on the at least one thermal characteristic,

wherein one of the first input node and the second input node includes a power semiconductor device temperature input node and the other of the first input node and the second input node includes a coolant temperature input node.

2. The method of claim 1 , wherein the power inverter is configured to drive an electric propulsion motor of an associated vehicle.

3. The method of claim 1 , wherein the thermal circuit includes at least one power source.

4. The method of claim 1 , wherein the at least one thermal characteristic includes a temperature at a node of the thermal circuit.

5. The method of claim 1 , further comprising

determining a plurality of other thermal characteristics of the thermal circuit using, at least, the first measured temperature and the second measured temperature.

6. The method of claim 1 , further comprising

determining a first power loss value associated with the first input node.

7. The method of claim 6 , further comprising

determining a coolant flow rate using the first power loss value.

8. A thermal circuit modeling system comprising:

a thermal circuit associated with a power inverter having at least a first input node and a second input node; and

a controller configured to:

set the first input node of the thermal circuit to a first measured temperature;

set the second input node of the thermal circuit to a second measured temperature;

determine at least one thermal characteristic of the thermal circuit using, at least, the first measured temperature and the second measured temperature; and

determine an operating temperature of the thermal circuit based on the at least one thermal characteristic,

wherein one of the first input node and the second input node includes a power semiconductor device temperature input node and the other of the first input node and the second input node includes a coolant temperature input node.

9. The system of claim 8 , wherein the power inverter is configured to drive an electric propulsion motor of an associated vehicle.

10. The system of claim 8 , wherein the thermal circuit includes at least one power source.

11. The system of claim 8 , wherein the at least one thermal characteristic includes a temperature at a node of the thermal circuit.

12. The system of claim 8 , wherein the controller is further configured to determine a plurality of other thermal characteristics of the thermal circuit using, at least, the first measured temperature and the second measured temperature.

13. The system of claim 8 , wherein the controller is further configured to determine a first power loss value associated with the first input node.

14. The system of claim 13 , wherein the controller is further configured to determine a coolant flow rate using the first power loss value.

15. A method for controlling a coolant flow rate of a modeled thermal circuit power inverter, the method comprising:

setting a first input node of a modeled thermal circuit associated with the power inverter to a first measured temperature;

setting a second input node of the modeled thermal circuit to a second measured temperature;

determining at least one thermal characteristic of the modeled thermal circuit using, at least, the first measured temperature and the second measured temperature;

determining the coolant flow rate of the power inverter based on the at least one thermal characteristic;

determining a first power loss value at the first input node; and

selectively adjusting the coolant flow rate of the modeled thermal circuit based on the first power loss value,

wherein one of the first input node and the second input node includes a power semiconductor device temperature input node and the other of the first input node and the second input node includes a coolant temperature input node.

16. The method of claim 15 , wherein the at least one thermal characteristic includes a temperature at a node of the modeled thermal circuit.

17. The method of claim 15 , further comprising

determining a plurality of other thermal characteristics of the modeled thermal circuit using, at least, the first measured temperature and the second measured temperature.