Micro-electromechanical system devices and methods
A micro-electromechanical system (MEMS) device includes a substrate and a beam suspended relative to a surface of the substrate. The substrate includes a buried insulator layer and a cavity. The beam includes a first portion and a second portion that are separated by an isolation joint. The cavity separates the surface of the substrate from the beam.
1. A micro-electromechanical system (MEMS) device comprising:
a substrate comprising a buried insulator layer and a cavity; and
a beam suspended relative to a surface of the substrate, the beam comprising a first portion and a second portion that are separated by an isolation joint,
wherein the cavity separates the surface of the substrate from the beam,
wherein the substrate comprises a semiconductor-on-insulator (SOI) substrate, and
wherein the buried insulator layer is configured to define the surface of the substrate forming the cavity.
2. The MEMS device of claim 1 , wherein the substrate comprises a second buried insulator layer.
3. The MEMS device of claim 2 , wherein the second buried insulator is configured to define a depth of the isolation joint in the cavity.
4. The MEMS device of claim 2 , wherein the buried insulator layer and the second buried insulator layer define the cavity.
5. The MEMS device of claim 1 , wherein the buried insulator layer is configured to define a depth of the isolation joint in the cavity.
6. The MEMS device of claim 1 , wherein the cavity is a pre-etched cavity.
7. The MEMS device of claim 6 , wherein the pre-etched cavity is disposed below the buried insulator layer.
8. The MEMS device of claim 7 , wherein the pre-etched cavity comprises a plurality of depths.
9. The MEMS device of claim 1 , wherein:
the first and second portions each comprise a semiconductor and a dielectric layer; and
an electrically conductive trace is mechanically coupled to the beam and electrically coupled to the semiconductor of the second portion but not the semiconductor of the first portion.
10. The MEMS device of claim 9 , further comprising a second beam suspended relative to the surface of the substrate, the second beam comprising a second dielectric layer configured to promote curvature of the second beam.
11. The MEMS device of claim 10 , further comprising a third beam suspended relative to the surface of the substrate.
12. The MEMS device of claim 11 , wherein the second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.
13. A handheld device comprising:
a micro-electromechanical system (MEMS) device, comprising:
a substrate comprising a buried insulator layer and a cavity; and
a beam suspended relative to a surface of the substrate, the beam comprising a first portion and a second portion that are separated by an isolation joint,
wherein the cavity separates the surface of the substrate from the beam,
wherein the substrate comprises a semiconductor-on-insulator (SOI) substrate, and
wherein the buried insulator layer is configured to define the surface of the substrate forming the cavity.
14. The handheld device of claim 13 , wherein the substrate comprises a second buried insulator layer.
15. The handheld device of claim 13 , wherein the cavity is a pre-etched cavity.
16. A micro-electromechanical system (MEMS) device comprising:
a semiconductor-on-insulator (SOI) substrate comprising:
a first buried insulator layer;
a second buried insulator layer; and
a cavity between the first and second buried insulator layers; and
a beam suspended relative to a surface of the SOI substrate, the beam comprising a first portion and a second portion that are separated by an isolation joint,
wherein the cavity separates the surface of the SOI substrate from the beam.
17. The MEMS device of claim 16 , wherein the first buried insulator layer is configured to define the surface of the SOI substrate forming the cavity.
18. The MEMS device of claim 16 , wherein the second buried insulator is configured to define a depth of the isolation joint in the cavity.
19. The MEMS device of claim 16 , wherein the first buried insulator layer defines a lower portion of the cavity and the second buried insulator layer defines an upper portion of the cavity.
20. The MEMS device of claim 16 , wherein the SOI substrate comprises silicon.