Electronic apparatus
An electronic apparatus includes a first board, a second board, a housing, and a first thermal conductive assembly. The housing accommodates the first board and the second board. The first thermal conductive assembly connects a face of the first board, the face of the first board fronting a region between the first board and the second board, to a first face of the housing or a second face of the housing. The first face is opposed to the first board, the second face is opposed to the second board.
1. An electronic apparatus comprising:
a first hoard;
a second board;
a housing that accommodates the first board and the second board; and
a first thermal conductive assembly that connects a face of the first board, the face of the first board fronting a region between the first board and the second board, to a first face of the housing or a second face of the housing, the first face being opposed to the first board, the second face being opposed to the second board.
2. The electronic apparatus according to claim 1 , wherein the first thermal conductive assembly has a hook shape.
3. The electronic apparatus according to claim 2 , wherein the first thermal conductive assembly includes a thermal conductive element that includes a first contact portion set in contact with the first board in the region between the first hoard and the second board, a second contact portion set in contact with the first face of the housing or the second face of the housing, and a connecting portion connecting the first contact portion to the second contact portion.
4. The electronic apparatus according to claim 3 , wherein the second board includes an opening at a position corresponding to an arrangement position of the second contact portion.
5. The electronic apparatus according to claim 4 , wherein the first thermal conductive assembly further includes a fixing part for fixing the thermal conductive element to the opening of the second board.
6. The electronic apparatus according to claim 1 , wherein
the first board includes a device that generates heat, and
the first thermal conductive assembly is arranged correspondingly to a position of the device that generates heat.
7. The electronic apparatus according to claim 6 , wherein
the first board or the second board further includes a nonvolatile memory,
the device that generates heat is a controller for controlling the nonvolatile memory, and
the first thermal conductive assembly is arranged on a reverse side of a mounting position of the controller on the first board.
8. The electronic apparatus according to claim 6 , wherein the first thermal conductive assembly is set in contact with the device that generates heat.
9. The electronic apparatus according to claim 3 , wherein the first contact portion is set in contact with the second board.
10. The electronic apparatus according to claim 3 , wherein
the second board includes a device that generates heat, and
the first contact portion is set in contact with the device.
11. The electronic apparatus according to claim 3 , wherein
the first board includes a first device that generates heat,
the second board includes a second device that generates heat, and
the first contact portion is set in contact with the first device and the second device.
12. The electronic apparatus according to claim 1 , further comprising:
a third board; and
a second thermal conductive assembly that connects a face of the third board, the face of the third board fronting a region between the first board and the third board; to the first face of the housing or the second face of the housing.
13. The electronic apparatus according to claim 1 , wherein the first thermal conductive assembly includes aluminum, copper, or a heat pipe.