IP Library Granted Patent US 10,916,698
Granted Patent B2
US 10,916,698 · App. 16/523,394 · Granted Feb 9, 2021

Semiconductor storage device including hexagonal insulating layer

Inventors: Katsuyoshi Komatsu (Yokkaichi Mie, JP); Takeshi Iwasaki (Kuwana Mie, JP)
Assignee: TOSHIBA MEMORY CORPORATION
H01L45/1233G11C13/004G11C13/0004H01L45/06
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Quick Facts
Patent No.
US 10,916,698
App. No.
16/523,394
Granted
Feb 9, 2021
Kind
B2
Abstract

A semiconductor storage device is disclosed. The device includes: a first conductive layer; a second conductive layer apart from the first conductive layer in a first direction; a variable resistance layer provided between the first conductive layer and the second conductive layer; a third conductive layer provided between the first conductive layer and the variable resistance layer; a nonlinear layer provided between the first conductive layer and the third conductive layer; and a first insulating layer provided at least between the first conductive layer and the nonlinear layer or between the third conductive layer and the nonlinear layer. The first insulating layer includes nitrogen (N) and boron (B).

Claims (21)

1. A semiconductor storage device comprising:

a first conductive layer;

a second conductive layer apart from the first conductive layer in a first direction;

a variable resistance layer provided between the first conductive layer and the second conductive layer;

a third conductive layer provided between the first conductive layer and the variable resistance layer;

a nonlinear layer provided between the first conductive layer and the third conductive layer; and

a first insulating layer provided at least between the first conductive layer and the nonlinear layer or between the third conductive layer and the nonlinear layer,

wherein

the first insulating layer has a crystal with a hexagonal structure and a (0001) plane of this crystal intersects with the first direction.

2. The semiconductor storage device according to claim 1 , wherein

a thickness of the first insulating layer in the first direction is less than or equal to 5 nanometers(nm).

3. The semiconductor storage device according to claim 1 , wherein

the nonlinear layer includes a chalcogen.

4. The semiconductor storage device according to claim 1 , wherein

the first insulating layer is provided between the first conductive layer and the nonlinear layer and between the third conductive layer and the nonlinear layer.

5. The semiconductor storage device according to claim 1 , wherein

the first insulating layer is in direct contact with the first conductive layer and the nonlinear layer.

6. The semiconductor storage device according to claim 1 , wherein

the first insulating layer is in direct contact with the third conductive layer and the nonlinear layer.

7. The semiconductor storage device according to claim 1 , wherein

the first insulating layer includes at least one of nitrogen or boron.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058905/0582 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2019
From: KOMATSU, KATSUYOSHI; IWASAKI, TAKESHI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 049873/0197 →