IP Library Granted Patent US 10,804,621
Granted Patent B2
US 10,804,621 · App. 16/524,225 · Granted Oct 13, 2020

Printed wiring board

Inventors: Akira Tanaka (Yokohama, JP); Masaya Hirashima (Yokohama, JP); Satoru Yasui (Kawasaki, JP); Shukuyo Yamada (Yokohama, JP); Masashi Watanabe (Yokohama, JP)
Assignee: KABUSHIKI KAISHA TOSHIBA
H01R4/027H01R4/028H05K1/117H05K1/181H05K2201/09036H05K2201/2027
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Quick Facts
Patent No.
US 10,804,621
App. No.
16/524,225
Granted
Oct 13, 2020
Kind
B2
Abstract

According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.

Claims (22)

1. A printed wiring board comprising:

a wiring board including a first main surface and a second main surface opposite to the first main surface;

a connector part;

a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material; and

a guide groove provided on the first main surface to extend from the connection pad, to guide a portion of the solder material from the connection pad.

2. The wiring board of claim 1 , further comprising:

a recessed region provided continuous to the guide groove, to receive the portion of the solder material.

3. The wiring board of claim 1 , further comprising:

a receptor film provided on the guide groove, to hold the portion of the solder material guided from the connection pad.

4. The wiring board of claim 3 , wherein

the receptor film is a resin film.

5. The wiring board of claim 1 , wherein

the wiring board includes an insulating substrate, an insulating layer and a conductor layer prepared between the insulating substrate and the insulating layer, and

at least a part of the guide groove, which is near the connection pad has a depth less than a thickness of the conductor layer.

6. The wiring board of claim 1 , wherein

the wiring board includes an insulating substrate, an insulating layer and a conductor layer prepared between the insulating substrate and the insulating layer, and

at least a part of the guide groove, which is near the connection pad has a depth which reaches the insulating substrate.

7. The wiring board of claim 1 , wherein the guide groove extends to be apart from the connector part.

8. The wiring board of claim 1 , wherein the guide groove extends in a direction towards at least a front end portion or a rear end portion of the connector part.

9. The wiring board of claim 1 , wherein the guide groove comprises:

a first guide groove which has a first depth, and is connected with the connection pad, and

a second guide groove which has a second depth greater than the first depth, and is continuous to the first guide groove.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2019
From: TANAKA, AKIRA; HIRASHIMA, MASAYA; YASUI, SATORU; YAMADA, SHUKUYO; WATANABE, MASASHI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 049883/0161 →
Priority Claims (1)
JP 2018-147787 · Aug 6, 2018 · national
Continuity (1)
Related Publication 20200044366A1 · Feb 6, 2020