Spatially variable wafer bias power system
A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.
1. A power system with plasma load comprising:
a first high voltage pulser that outputs a first plurality of pulses having a first voltage greater than about 1 kV, a first pulse width less than about 1 μs, and a first pulse repletion frequency greater than about 20 kHz;
a second high voltage pulser that outputs a second plurality of pulses having a second voltage greater than about 1 kV, a second pulse width less than about 1 μs, and a second pulse repletion frequency greater than about 20 kHz;
a chamber;
a first electrode disposed within the chamber and electrically coupled with the first high voltage pulser; and
a second electrode disposed within the chamber adjacent with the first electrode and electrically coupled with the second high voltage pulser;
wherein the chamber includes either or both a wafer and a plasma that is capacitively coupled with the first electrode and the second electrode with a capacitance between 10 pF and 1 μF.
2. The system according to claim 1 , wherein an electric field across the surface of the wafer is uniform within 25%.
3. The system according to claim 1 , wherein the coupling capacitance between the first electrode and a corresponding portion of the wafer is greater than 100 pF; and the capacitance between the second electrode and a corresponding portion of the wafer is greater than 100 pF.
4. The system according to claim 1 , wherein the chamber includes a plasma of ions that are accelerated onto a wafer.
5. The system according to claim 1 , wherein the first high voltage pulser produces an electrode voltage on the first electrode that is greater than about 1 kV, and the second high voltage pulser produces an electrode voltage on the second electrode that is greater than about 1 kV.
6. The system according to claim 1 , wherein the ratio of the first voltage relative to the second voltage is less than two to one or vice versa.
7. The system according to claim 1 , wherein either or both the first electrode and the second electrode are axially symmetric.
8. The system according to claim 1 , wherein the first electrode has a first planar surface and the second electrode has a second planar surface such that the second planar surface is 25% of the total of the first planar surface and the second planar surface.
9. The system according to claim 1 , wherein both the first the first high voltage pulser and the second high voltage pulser comprise a resistive output stage.
10. The system according to claim 1 , wherein both the first high voltage pulser and the second high voltage pulser comprise an energy recovery circuit.
11. The system according to claim 1 , wherein the parameters of the first plurality of pulses are controlled independently of the parameters of the second plurality of pulses.
12. The system according to claim 1 , wherein the first pulse repletion frequency and the second pulse repetition frequency are in phase with respect of each other.
13. The system according to claim 1 , wherein the coupling capacitance between the first electrode and the second electrode is less than about 10 nF.