IP Library Granted Patent US 10,854,269
Granted Patent B2
US 10,854,269 · App. 16/526,198 · Granted Dec 1, 2020

Apparatuses and methods for compute components formed over an array of memory cells

Inventor: Jason T. Zawodny (Grand Rapids, MI)
Assignee: Micron Technology, Inc.
G11C11/4023G11C5/025G11C7/1006G11C11/402G11C11/403G11C11/406G11C11/407G11C2211/4068
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,854,269
App. No.
16/526,198
Granted
Dec 1, 2020
Kind
B2
Abstract

The present disclosure includes apparatuses and methods related to compute components formed over an array of storage elements. An example apparatus comprises a base substrate material and an array of memory cells formed over the base substrate material. The array can include a plurality of access transistors comprising a first semiconductor material. A compute component can be formed over and coupled to the array. The compute component can include a plurality of compute transistors comprising a second semiconductor material. The second semiconductor material can have a higher concentration of doping ions than the first semiconductor material.

Claims (45)

1. An apparatus, comprising:

an array of memory cells comprising a plurality of access transistors comprising a first semiconductor material; and

a compute component formed over and coupled to the array, wherein the compute component includes a plurality of compute transistors comprising a second semiconductor material,

wherein the second semiconductor material has a different concentration of doping ions than the first semiconductor material, and

wherein the different concentration of doping ions corresponds to a higher leakage current of the plurality of compute transistors than that of the plurality of access transistors.

2. The apparatus of claim 1 , wherein the second semiconductor material has a higher concentration of doping ions than the first semiconductor material.

3. The apparatus of claim 1 , wherein the second semiconductor material has a lower concentration of doping ions than the first semiconductor material.

4. The apparatus of claim 1 , further comprising a plurality of metal interconnects interconnecting the plurality of access transistors, the array, and the compute component.

5. The apparatus of claim 1 , further comprising sensing circuitry, wherein the sensing circuitry comprises:

the compute component; and

a sense amplifier coupled to the compute component.

6. The apparatus of claim 5 , wherein the sensing circuitry is configured to perform logic operations on data stored in the array.

7. A method, comprising:

forming a plurality of compute transistors comprising a semiconductor material over an array of storage elements;

doping the semiconductor material to a particular concentration of doping ions subsequent to all heating cycles associated with forming the array; and

forming sensing circuitry in the semiconductor material.

8. The method of claim 7 , wherein doping the semiconductor material comprises doping the semiconductor material to a higher concentration of doping ions is than a concentration of doping ions of a semiconductor material of the array.

9. The method of claim 7 , wherein doping the semiconductor material comprises doping the semiconductor material to a lower concentration of doping ions is than a concentration of doping ions of a semiconductor material of the array.

10. The method of claim 7 , wherein forming the sensing circuitry comprises:

forming a compute component; and

forming a sense amplifier coupled to the compute component.

11. The method of claim 10 , further comprising forming a plurality of metal interconnects coupled to the plurality of access transistors, the array, and the compute component.

12. A method, comprising:

forming, over an array of storage elements, including a plurality of access transistors comprising a first semiconductor material, a plurality of compute transistors comprising a second semiconductor material,

wherein the second semiconductor material has a different concentration of doping ions than the first semiconductor material corresponding to a shorter refresh cycle of the plurality of compute transistors than that of the plurality of access transistors.

13. The method of claim 12 , wherein the second semiconductor material has a higher concentration of doping ions than the first semiconductor material.

14. The method of claim 12 , wherein the second semiconductor material has a lower concentration of doping ions than the first semiconductor material.

15. An apparatus, comprising:

an array of memory cells comprising a plurality of access transistors comprising a first semiconductor material; and

a compute component formed over and coupled to the array, wherein the compute component includes a plurality of compute transistors comprising a second semiconductor material,

wherein the second semiconductor material has a different concentration of doping ions than the first semiconductor material, and

wherein the different concentration of doping ions corresponds to a shorter refresh cycle of the plurality of compute transistors than that of the plurality of access transistors.

16. An apparatus, comprising:

an array of memory cells comprising a plurality of access transistors comprising an amorphous silicon first semiconductor material; and

a compute component formed over and coupled to the array, wherein the compute component includes a plurality of compute transistors comprising an amorphous silicon second semiconductor material,

wherein the amorphous silicon second semiconductor material has a different concentration of doping ions than the amorphous silicon first semiconductor material.

17. An apparatus, comprising:

an array of memory cells comprising a plurality of access transistors comprising a first semiconductor material;

a compute component formed over and coupled to the array, wherein the compute component includes a plurality of compute transistors comprising a second semiconductor material,

wherein the second semiconductor material has a different concentration of doping ions than the first semiconductor material; and

global metal interconnects and pads formed on the compute component.

18. A method, comprising:

forming a plurality of compute transistors comprising an amorphous semiconductor material over an array of storage elements;

doping the amorphous semiconductor material to a particular concentration of doping ions; and

forming sensing circuitry in the amorphous semiconductor material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2019
From: ZAWODNY, JASON T.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 049904/0490 →
Continuity (3)
Continuation 15806123 · Nov 7, 2017
Provisional Application 62419004 · Nov 8, 2016
Related Publication 20190355406A1 · Nov 21, 2019