Substrate, electronic substrate, and method for producing electronic substrate
A substrate is capable of effectively reinforcing a connecting portion between an electronic component and the substrate. The substrate is a substrate on which a first electronic component having a plurality of bumps is to be mounted, and includes a base portion including an insulator and having, on the upper face thereof, at least one groove portion configured to store a tip portion of at least one of the bumps, and includes an electrode formed on at least the bottom face of the groove portion.
1. A substrate on which a first electronic component having a plurality of bumps is to be mounted, the substrate comprising:
a base portion including an insulator and having, on an upper face thereof, a plurality of groove portions each configured to receive a tip portion of a corresponding one of the bumps of the first electronic component; and
a plurality of first electrodes on at least a bottom face of each of the plurality of groove portions wherein
the plurality of groove portions are located in an outer peripheral area on the base portion,
the base portion includes a recessed portion located inward of the outer peripheral area,
an upper face of the recessed portion being a flat surface which is recessed from an upper face of the outer peripheral area,
a plurality of second electrodes are configured to be connected to the plurality of bumps configured to be disposed in the recessed portion, and
an upper surface of each of the plurality of second electrodes being flush with an upper surface of the recessed portion.
2. The substrate according to claim 1 , wherein the plurality of first electrodes are on the bottom face and a side face of each of the plurality of groove portions.
3. The substrate according to claim 1 , wherein a plurality of the groove portions are on the upper face in a grid pattern.