Sensor device and electronic assembly

1. A sensor device comprising:

a first pellistor element;

a second pellistor element;

a heater element;

a first temperature sensor element;

a second temperature sensor element,

wherein the heater element and the first temperature sensor element are part of the first pellistor element and the heater element and the second temperature sensor element are part of the second pellistor element;

a substrate carrying the first pellistor element and the second pellistor element; and

a membrane arranged on the substrate,

wherein the heater element is arranged in the membrane, and/or

wherein both the first temperature sensor element and the second temperature sensor element are arranged in or on the membrane,

wherein the first temperature sensor element and the second temperature sensor element are arranged in the same plane in or on the membrane, and

wherein the first and second temperature sensor elements are formed in an interlocking meandering shape.

2. The sensor device according to claim 1 , further comprising a catalyst element, wherein the catalyst element is part of each of the first pellistor element and the second pellistor element.

3. The sensor device according to claim 1 , wherein the heater element comprises a noble metal.

4. The sensor device according to claim 1 , further comprising a catalyst element, wherein the catalyst element is part of each of the first pellistor element and the second pellistor element, and wherein the catalyst element is arranged on the membrane.

5. The sensor device according to claim 1 , wherein the membrane comprises silicon oxide and/or silicon nitride, and wherein the membrane at least partly encloses the heater element and/or the first and second temperature sensor elements.

6. The sensor device according to claim 1 , wherein the substrate comprises silicon.

7. The sensor device according to claim 1 , wherein the interlocked meandering shape comprises a first U-shaped part of the first temperature sensor element that partly encloses a first U-shaped part of the second temperature sensor element and a second U-shaped part of the second temperature sensor element that partly encloses a second U-shaped part of the first temperature sensor element.

8. The sensor device according to claim 1 , wherein the first temperature sensor element has a first part, a second part and a third part, and the second temperature sensor element has a first part, a second part and a third part, and wherein the interlocked meandering shape is provided by the first and second parts of the second temperature sensor element being arranged next to each other and between the first part and the second part of the first temperature sensor element, and the second and third parts of the first temperature sensor element being arranged next to each other and between the second part and the third part of the second temperature sensor element.

9. The sensor device according to claim 1 , wherein the first temperature sensor element has a first part, a second part and a third part, and the second temperature sensor element has a first part, a second part and a third part, and wherein the interlocked meandering shape is provided by the first, second and third parts of both the first and second temperature sensor elements being arranged as straight lines that are parallel to each other.

10. The sensor device according to claim 1 , wherein the first temperature sensor element has a first part, a second part and a third part, and the second temperature sensor element has a first part, a second part and a third part, wherein the interlocked meandering shape is provided by the first part and second part, for each of the first and second temperature sensor elements, being connected by a first connection part, and the second part and the third part being connected by a second connection part, and wherein each of the first and second connection parts of each of the first and second temperature sensor elements are curved.

11. The sensor device according to claim 1 , wherein the first temperature sensor element and/or the second temperature sensor element comprise(s) a material selected from a thermistor material, an NTC material, a PTC material or a noble metal.

12. The sensor device according to claim 11 , wherein the noble metal comprises Pt.

13. An electronic assembly comprising:

a first active pellistor element;

a second active pellistor element;

a first reference pellistor element; and

a second reference pellistor element,

wherein the first and second active pellistor elements and the first and second reference pellistor elements are connected with each other forming a Wheatstone Bridge,

wherein the Wheatstone Bridge has a first connection point, a second connection point, a third connection point and a fourth connection point,

wherein the first active pellistor element is arranged between the first and the second connection points,

wherein the first reference pellistor element is arranged between the second and the third connection points,

wherein the second active pellistor element is arranged between the third and the fourth connection points,

wherein the second reference pellistor element is arranged between the first and the fourth connection points,

wherein the first and the third connection points are configured for being connected to an electrical voltage,

wherein the second and fourth connection points are configured for being connected to a measurement device,

wherein the first and second active pellistor elements are part of a first sensor device comprising the first active pellistor element, the second active pellistor element, a first heater element, a first temperature sensor element and a second temperature sensor element, wherein the first heater element and the first temperature sensor element are part of the first active pellistor element and the first heater element and the second temperature sensor element are part of the second active pellistor element, and

wherein the first and the second reference pellistor elements are part of a second sensor device comprising the first reference pellistor element, the second reference pellistor element, a second heater element, a third temperature sensor element and a fourth temperature sensor element, wherein the second heater element and the third temperature sensor element are part of the first reference pellistor element and the second heater element and the fourth temperature sensor element are part of the second reference pellistor element.

14. The electronic assembly according to claim 13 , wherein the first and the second sensor devices are monolithically formed comprising a common substrate.

15. A sensor device comprising:

a first pellistor element;

a second pellistor element;

a heater element;

a first temperature sensor element;

a second temperature sensor element,

wherein the heater element and the first temperature sensor element are part of the first pellistor element and the heater element and the second temperature sensor element are part of the second pellistor element;

a substrate carrying the first pellistor element and the second pellistor element; and

a membrane arranged on the substrate,

wherein the heater element is arranged in the membrane, and/or

wherein both the first temperature sensor element and the second temperature sensor element are arranged in or on the membrane,

wherein the first temperature sensor element and the second temperature sensor element are arranged in the same plane in or on the membrane, and

wherein each of the first temperature sensor element, the second temperature sensor element and the heater element are arranged in respective different planes in the membrane so that the first temperature sensor element, the second temperature sensor element and the heater element are stacked over each other along a direction perpendicular to the planes.

16. The sensor device according to claim 15 , further comprising a catalyst element, wherein the catalyst element is part of each of the first pellistor element and the second pellistor element.

17. The sensor device according to claim 15 , further comprising a catalyst element, wherein the catalyst element is part of each of the first pellistor element and the second pellistor element, and wherein the catalyst element is arranged on the membrane.

18. The sensor device according to claim 15 , wherein the membrane comprises silicon oxide and/or silicon nitride, and wherein the membrane at least partly encloses the heater element and/or the first and second temperature sensor elements.

19. The sensor device according to claim 15 , wherein the substrate comprises silicon.

20. The sensor device according to claim 15 , wherein the first temperature sensor element and/or the second temperature sensor element comprise(s) a material selected from a thermistor material, an NTC material, a PTC material or a noble metal.

21. The sensor device according to claim 20 , wherein the noble metal comprises Pt.

22. The sensor device according to claim 20 , wherein the heater element comprises a noble metal.