IP Library Granted Patent US 11,764,328
Granted Patent B2
US 11,764,328 · App. 16/539,539 · Granted Sep 19, 2023

Light-emitting diode package having bump formed in wriggle shape

Inventors: Ying-Yong Su (Hsinchu, TW); Hsin-Mao Liu (Hsinchu, TW); Wei-Shan Hu (Hsinchu, TW); Ching-Tai Cheng (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/20H01L33/38
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Quick Facts
Patent No.
US 11,764,328
App. No.
16/539,539
Granted
Sep 19, 2023
Kind
B2
Abstract

The light-emitting diode package includes a plurality of bumps being a couple corresponding to each other. Each of the bumps has a first part and a second part placed under the first part, and a gap is formed between the bumps in a period-repeating wriggle shape or an irregular wriggle shape. Accordingly, the distance between the bumps of the light-emitting diode package is small, which results in a less stress being concentrated at the space between the bumps, as a result, a crack is difficultly caused by the stress to the light-emitting diode package, in other words, the structural strength between the bumps and the covering part is enhanced. Still, while being manufactured, the yield rate of the light-emitting diode package is also improved since there is almost no crack to reduce the yield rate.

Claims (23)

1. A light-emitting diode package, comprising:

an LED chip, comprising a lateral surface;

a pair of bumps, arranged under the LED chip without extending out from the lateral surface, and separated from each other by a first gap and a second gap, each bump of the pair of bumps including a first part and a second part placed under the first part, the first gap is between the first parts, the second gap is between the second parts, and the first gap is smaller than the second gap;

a protecting part, connected to the LED chip and separated from the pair of bumps by an annular gap; and

a covering part, surrounding the pair of bumps;

wherein each of the first parts has a first horizontal width, and each of the second parts has a second horizontal width smaller than the corresponding first horizontal width, and

wherein the first parts and the second parts are made of metals, each of the first parts has a first lateral surface facing to the first gap, each of the second parts has a second lateral surface facing to the second gap, the first lateral surface has a wriggle shape, the second lateral surface has a flat shape.

2. The light-emitting diode package according to claim 1 , wherein the wriggle shape of the first lateral surface is a period-repeating wriggle shape or an irregular wriggle shape.

3. The light-emitting diode package according to claim 1 , wherein the pair of bumps comprises Cu, Ni, Cr, Sn or Ag.

4. The light-emitting diode package according to claim 1 , wherein the first gap has a width which is between 1 μm and 30 μm, each of the first parts has a vertical height, and a ratio of the width to the vertical height is between 0.5 and 2.0.

5. The light-emitting diode package according to claim 1 , wherein each of the first parts has a surrounding formed in a period-repeating wriggle shape.

6. The light-emitting diode package according to claim 1 , wherein each of the first parts has a surrounding formed in an irregular wriggle shape.

7. The light-emitting diode package according to claim 1 , wherein each of the first parts has a first thickness, each of the second parts has a second thickness thicker than the corresponding first thickness.

8. The light-emitting diode package according to claim 1 , wherein the covering part fully contacts the first lateral surface and the second lateral surface.

9. The light-emitting diode package according to claim 1 , wherein the protecting part is covered by the covering part.

10. The light-emitting diode package according to claim 1 , wherein the protecting part has a bottom surface covered by the covering part.

11. The light-emitting diode package according to claim 10 , wherein the pair of bumps has a bottommost surface, the bottom surface has an elevation higher than that of the bottommost surface.

12. The light-emitting diode package according to claim 1 , wherein the protecting part has a shape of rectangle.

13. The light-emitting diode package according to claim 1 , wherein in a bottom view, the protecting part has an area smaller than that of each of the second parts.

14. The light-emitting diode package according to claim 1 , wherein each of the first parts has a first outer lateral surface opposite to the first gap, the first outer lateral surface is flat.

15. The light-emitting diode package according to claim 1 , wherein the covering part is filled in the second gap.

16. The light-emitting diode package according to claim 1 , wherein the lateral surface is not covered by the covering part.

17. The light-emitting diode package according to claim 16 , wherein the lateral surface is coplanar with the covering part.

Assignments (2)
CHANGE OF NAME Recorded Feb 26, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075152/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2019
From: SU, YING-YONG; LIU, HSIN-MAO; HU, WEI-SHAN; CHENG, CHING-TAI
To: EPISTAR CORPORATION
Reel/Frame 050065/0875 →
Continuity (1)
Related Publication 20210050478A1 · Feb 18, 2021