Semiconductor device and method of manufacturing the same
In one embodiment, a semiconductor device includes a first substrate, and a plurality of electrode layers provided above the first substrate and stacked in a first direction. The device further includes a first semiconductor layer extending in the first direction in the plurality of electrode layers, and a metal layer provided above an uppermost one of the plurality of electrode layers and extending to cross the first direction. The device further includes a second semiconductor layer including an impurity diffusion layer that is provided between the first semiconductor layer and the metal layer, electrically connects the first semiconductor layer with the metal layer, and has an impurity concentration higher than an impurity concentration of the first semiconductor layer.
1. A semiconductor device of comprising:
a first substrate;
a plurality of electrode layers provided above the first substrate and stacked in a first direction;
a first semiconductor layer extending in the first direction in the plurality of electrode layers;
a metal layer provided above an uppermost one of the plurality of electrode layers and extending to cross the first direction; and
a second semiconductor layer including an impurity diffusion layer that is provided between the first semiconductor layer and the metal layer, electrically connects the first semiconductor layer with the metal layer, and has an impurity concentration higher than an impurity concentration of the first semiconductor layer,
the device comprising, as the first semiconductor layer, a plurality of first semiconductor layers provided in an array in an in-plane direction of the plurality of electrode layers,
wherein the second semiconductor layer is electrically connected to each of the plurality of first semiconductor layers.
2. The device of claim 1 , wherein
the first semiconductor layer has a columnar shape extending in the first direction; and
the second semiconductor layer has a columnar shape extending in the first direction on the first semiconductor layer.
3. The device of claim 1 , wherein
the first substrate is provided in a first chip that includes a logic circuit; and
the plurality of electrode layers are provided in a second chip that is provided on the first chip and includes a memory cell array.
4. A semiconductor device comprising:
a first substrate;
a plurality of electrode layers provided above the first substrate and stacked in a first direction;
a first semiconductor layer extending in the first direction in the plurality of electrode layers;
a metal layer provided above an uppermost one of the plurality of electrode layers and extending to cross the first direction; and
a second semiconductor layer including an impurity diffusion layer that is provided between the first semiconductor layer and the metal layer, electrically connects the first semiconductor layer with the metal layer, and has an impurity concentration higher than an impurity concentration of the first semiconductor layer,
wherein the metal layer annularly surrounds the second semiconductor layer.
5. A semiconductor device comprising:
a first substrate;
a plurality of electrode layers provided above the first substrate and stacked in a first direction;
a first semiconductor layer extending in the first direction in the plurality of electrode layers;
a metal layer provided above an uppermost one of the plurality of electrode layers and extending to cross the first direction; and
a second semiconductor layer including an impurity diffusion layer that is provided between the first semiconductor layer and the metal layer, electrically connects the first semiconductor layer with the metal layer, and has an impurity concentration higher than an impurity concentration of the first semiconductor layer,
wherein the second semiconductor layer annularly surrounds the first semiconductor layer.
6. A semiconductor device comprising:
a first substrate;
a plurality of electrode layers provided above the first substrate and stacked in a first direction;
a first semiconductor layer extending in the first direction in the plurality of electrode layers;
a metal layer provided above an uppermost one of the plurality of electrode layers and extending to cross the first direction; and
a second semiconductor layer including an impurity diffusion layer that is provided between the first semiconductor layer and the metal layer, electrically connects the first semiconductor layer with the metal layer, and has an impurity concentration higher than an impurity concentration of the first semiconductor layer,
wherein
the first semiconductor layer includes a first portion provided around a side face of a first insulator, and a second portion provided on the first insulator and the first portion; and
the second semiconductor layer is provided on the second portion.
7. The device of claim 6 , further comprising a second insulator provided around a side face of the second portion to form an annular shape.
8. The device of claim 6 , wherein the second semiconductor layer includes:
a first region provided above a plurality of first semiconductor layers; and
a plurality of second regions projecting from the first region toward upper portions of individual ones of the first semiconductor layers.
9. A semiconductor device comprising:
a first substrate;
a plurality of electrode layers provided above the first substrate, stacked to be spaced away from one another in a first direction that crosses a surface of the first substrate, and extending orthogonal to the first direction;
a first semiconductor layer provided in the plurality of electrode layers, and extending in the first direction; and
a second semiconductor layer provided around the first semiconductor layer to form an annular shape, electrically connected to the first semiconductor layer, and having an impurity concentration higher than an impurity concentration of the first semiconductor layer,
the device comprising, as the first semiconductor layer, a plurality of first semiconductor layers provided in an array in an in-plane direction of the plurality of electrode layers,
wherein the second semiconductor layer is electrically connected to each of the plurality of first semiconductor layers.
10. The device of claim 9 , further comprising a charge storage layer provided around the first and second semiconductor layers to form an annular shape.
11. The device of claim 9 , wherein
the first substrate is provided in a first chip that includes a logic circuit; and
the plurality of electrode layers are provided in a second chip that is provided on the first chip and includes a memory cell array.
12. A semiconductor device comprising:
a first substrate;
a plurality of electrode layers provided above the first substrate, stacked to be spaced away from one another in a first direction that crosses a surface of the first substrate, and extending orthogonal to the first direction;
a first semiconductor layer provided in the plurality of electrode layers, and extending in the first direction; and
a second semiconductor layer provided around the first semiconductor layer to form an annular shape, electrically connected to the first semiconductor layer, and having an impurity concentration higher than an impurity concentration of the first semiconductor layer,
wherein the second semiconductor layer annularly surrounds the first semiconductor layer.