Semiconductor device and method of manufacturing the same

1. A semiconductor device comprising:

a first water or a first chip including a first insulator having a first surface, and a first pad provided in the first insulator and including a first depressed portion that is depressed from the first surface; and

a second wafer or a second chip including a second insulator having a second surface that is in contact with the first surface, and a second pad provided in the second insulator, opposed to the first pad, and including a second depressed portion that is depressed from the second surface,

wherein

a plating material is provided between the first depressed portion and the second depressed portion, and electrically connecting the first pad to the second pad, and

the first insulator includes a first trench provided on the first surface, and extending from a first end of the first wafer or the first chip to the first pad, and/or

the second insulator includes a second trench provided on the second surface, and extending from a second end of the second wafer or the second chip to the second pad.

2. The device of claim 1 , wherein

the first trench is provided on the first surface of the first insulator and on a surface of the first pad; and/or

the second trench is provided on the second surface of the second insulator and on a surface of the second pad.

3. The device of claim 1 , wherein the first trench extends from the first end of the first wafer or file first chip to a third end of the first water or the first chip via the first pad; and/or

the second trench extends from the second end of the second wafer or the second chip to a fourth end of the second wafer or the second chip via the second pad.

4. The device of claim 1 , wherein when the first insulator includes a plurality of trenches that are provided on the first surface and include the first trench, a ratio of an area of the plurality of trenches of the first insulator to an area of the first surface of the first insulator is 50% or less; and/or

when the second insulator includes a plurality of trenches that are provided on the second surface and include the second trench, a ratio of an area of the plurality of trenches of the second insulator to an area of the second surface, of the second insulator is 50% or less.

5. The device of claim 1 , wherein at least one of the first trench and the second trench includes a first portion that extends in a first direction and a second portion that is coupled to the first portion and extends in a second direction different from the first direction.

6. The device of claim 1 , wherein the first insulator includes the first trench, and the second insulator includes the second trench.

7. The device of claim 6 , wherein the second trench extends in parallel to the first trench.

8. The device of claim 6 , wherein

the second insulator is located in a third direction of the first insulator, and

the second trench is provided to overlap with at least a portion of the first trench in the third direction.

9. The device of claim 6 , wherein

the second insulator is located in a third direction of the first insulator, and

the second trench is provided not to overlap with the first trench in the third direction.

10. A method of manufacturing a semiconductor device, comprising:

preparing a first wafer or a first chip including a first insulator having a first surface, and a first pad provided in the first insulator and including a first depressed portion that is depressed from the first surface; and

preparing a second wafer or a second chip including a second insulator having a second surface, and a second pad provided in the second insulator and including a second depressed portion that is depressed from the second surface;

forming a first trench provided on the first surface and extending from a first end of the first wafer or the first chip to the first pad in the first insulator, and/or forming a second trench provided on the second surface and extending from a second end of the second wafer or the second chip to the second pad in the second insulator;

bonding the first water or the first chip to the second water or the second chip such that the first surface is in contact with the second surface and the first pad is opposed to the second pad; and

providing a plating material between the first depressed portion and the second depressed portion to electrically connect the first pad to the second pad.

11. The method of claim 10 , further comprising pouring a liquid that includes the plating material from the first trench and/or the second trench into a region between the first pad and the second pad to electrically connect the first pad to the second pad via the plating material.

12. The method of claim 10 , wherein

the first trench is formed on the first surface of the first insulator and on a surface of the first pad; and/or

the second trench is formed on the second surface of the second insulator and on a surface of the second pad.

13. The method of claim 10 , wherein

the first trench is formed to extend from the first end of the first water or the first chip to a third end of the first wafer or the first chip via the first pad; and/or

the second trench is formed to extend from the second end of the second wafer or the second chip to a fourth end of the second wafer or the second chip via the second pad.

14. The method of claim 10 , wherein the first trench is formed in the first insulator, and the second trench is formed in the second insulator.

15. The method of claim 10 , wherein at least one of the first trench and the second trench includes a first portion that extends in a first direction and a second portion that is coupled to the first portion and extends in a second direction different from the first direction.