Self-circulating cooling system
A system for cooling an electronic device includes a pressure tank in a sealed cavity, the cavity being filled with an insulating liquid. The electronic device is also housed in the cavity and is immersed in the insulating liquid. The pressure tank is immersed in water. The liquid when heated becomes less dense and flows to exchange and lose heat to the cold water via the pressure tank. After cooling by the pressure tank, the now-denser liquid flows back to the other side of the electronic device because of density differences.
1. A cooling system comprising: a pressure tank defining a sealed cavity, wherein the pressure tank is adapted for immersing in water when the cavity is fully filled with insulating liquid, when in use, the 5 cavity is configured for housing an electronic device and immersing the electronic device in the insulating liquid, the insulating liquid exchanges heat with the water environment via the pressure tank; driving by density differences between heated insulating liquid and cooled insulating liquid, the insulating liquid flows in and out of the electronic device recurrently; and further comprising a supporting part, wherein the supporting part is positioned in the cavity and is configured for immobilizing the electronic device, the supporting part defines a first hole and a second hole, the first hole is configured for being located above the electronic device, and the second hole is configured for being located below the electronic device, and wherein the supporting part defines a tube and a plurality of nozzles, wherein the plurality of nozzles are in fluid communication with the tube.
2. The cooling system of claim 1 , further comprising a driving pump set in the cavity and is located away from the surface of the water environment, the driving pump drives the insulating liquid flows to the electronic device.
3. The cooling system of claim 2 , further comprising a guiding part set in the cavity, the guiding part seals one of the plurality of nozzles which is away from the surface of the water environment, the driving pump is located at one side of the guiding part which is away from the electronic device, the guiding part defines a guiding path which is connected to the driving pump, the guiding part defines a plurality of guiding ports towards the electronic device and connected 5 to the guiding path.
4. The cooling system of claim 3 , wherein the guiding part defines a plurality of connecting ports which are used for docking with the plurality of nozzles.
5. The cooling system of claim 1 , wherein the insulating liquid fully immerses the electronic device.
6. The cooling system of claim 1 , wherein the shell of the pressure tank is waterproof, stress-resistant, and heat-conductive.
7. The cooling system of claim 1 , wherein a distance between the electronic device to one side of the pressure tank which is near the surface of the water environment is closer than a distance between the electronic device to the other side of the pressure tank.
8. A cooling system comprising: a pressure tank defining a sealed cavity, wherein the cavity is partly filled with insulating liquid, the pressure tank is immersed in a water environment, when in use, the cavity is used for housing an electronic device and the insulating liquid immerses the electronic device, the insulating liquid exchanges heat with the water environment via the pressure tank; driving by density difference between heated insulating liquid and cooled insulating liquid, the insulating liquid flows in and out of the electronic device recurrently; and further comprising a supporting part, wherein the supporting part is set in the cavity and is used for immobilizing the electronic device, the supporting part defines a first hole and a second hole, the first hole is configured for being located above the electronic device, and the second hole is configured for being located below the electronic device, and wherein the supporting part defines a tube and a plurality of nozzles, wherein the plurality of nozzles are in fluid communication with the tube.
9. The cooling system of claim 8 , further comprising a driving pump set in the cavity and is located away from the surface of the water environment, the driving pump drives the insulating liquid flows to the electronic device.
10. The cooling system of claim 9 , further comprising a guiding part set in the cavity, the guiding part seals one of the plurality of nozzles which is away from the surface of the water environment, the driving pump is located at one side of the guiding part which is away from the electronic device, the guiding part defines a guiding path which is connected to the driving pump, the guiding part defines a plurality of guiding ports towards the electronic device and connected to the guiding path.
11. The cooling system of claim 10 , wherein the guiding part defines a plurality of connecting ports which are used for docking with the plurality of nozzles.
12. The cooling system of claim 8 , wherein the insulating liquid fully immerses the electronic device.
13. The cooling system of claim 8 , wherein the shell of the pressure tank is waterproof, stress-resistant, and heat-conductive.
14. The cooling system of claim 8 , wherein a distance between the electronic device to one side of the pressure tank which is near the surface of the water environment is closer than a distance between the electronic device to the other side of the pressure tank.