Addressable color changeable LED structure

1. A light-emitting device package, comprising:

a metalized substrate, comprising:

a top surface;

pads on the top surface; and

traces extending from the pads to a perimeter of the top surface;

a light-emitting diode (LED) die comprising junctions mounted on the pads, the junctions being addressable through the traces and sized to be less than 500 micrometers in size; and

a single primary optic over the LED die.

2. The package of claim 1 , wherein the primary optic comprises an overmolded silicone lens, an overmolded glass lens, a flat window, a preformed silicone lens, or a preformed glass lens.

3. The package of claim 1 , wherein the junctions emit different colors of light.

4. The package of claim 3 , wherein the junctions have different bandgap energies.

5. The package of claim 3 , wherein the LED die further comprises individual wavelength converters each located over a different junction.

6. The package of claim 1 , wherein:

the junctions have a common electrode of one polarity and individual electrodes of an opposite polarity;

each of the common electrode and the individual electrodes is mounted on a different pad; and

each trace is connected to a different pad.

7. The package of claim 1 , wherein:

the junctions have individual cathodes and individual anodes each mounted on a different pad; and

pads of one polarity connect to a same trace and pads of an opposite polarity connect to individual traces.

8. The package of claim 1 , wherein:

the junctions have individual cathodes and individual anodes each mounted on a different pad; and

each trace is connected to a different pad.

9. The package of claim 1 , wherein the metalized substrate comprises:

one or more vias connected to one or more pads; and

one or more traces connected to the one or more vias under the top surface.

10. The package of claim 1 , wherein a trace to an inner pad passes between outer pads.

11. The package of claim 1 , wherein:

the metalized substrate includes:

a first row of first pads;

a second row of second pads;

first traces fanning out from the first pads to the perimeter of the metalized substrate along a first direction and a second direction; and

second traces fanning out from the second pads to the perimeter of the metalized substrate;

at least one second trace passes between neighboring first pads along the first direction; and

at least another second trace passes between neighboring first pad and second pad along the second direction.

12. The package of claim 11 , wherein:

the metalized substrate includes:

a third row of third pads; and

third traces fanning out from the third pads to the perimeter of the metalized substrate;

at least one third trace passes between neighboring second pads and neighboring first pads along the first direction; and

at least another third trace passes between neighboring second pad and third pad along the second direction.

13. The package of claim 1 , wherein:

the pads include a first row of first pads, a second row of second pads, a third row of third pads, and a fourth row of fourth pads; and

the traces include:

first traces fanning out from the first pads to the perimeter of the metalized substrate in a first direction;

second traces fanning out from the second pads to the perimeter of the metalized substrate, the second traces passing between the first pads along the first direction;

fourth traces fanning out from the fourth pads to the perimeter of the metalized substrate along a second direction; and

third traces fanning out from the third pads to the perimeter of the metalized substrate, the third traces passing between the fourth traces along the second direction.

14. The package of claim 1 , wherein the LED is segmented.

15. The package of claim 1 , wherein the LED is segmented, with at least some of the segments supporting multiple junctions.

16. The package of claim 1 , wherein the LED is segmented, with at least some of the segments supporting multiple junctions that are addressed as groups.

17. The package of claim 1 , wherein at least some of the junctions can be individually addressed.

18. The package of claim 1 , wherein at least some of the junctions can be individually addressed and operated to allow beam steering.

19. The package of claim 1 , wherein at least some of the junctions can be individually addressed and operated to allow at least one of spot reduction, highlighting, and dynamic lighting effects.

20. The package of claim 1 , wherein the LED mounted on a ceramic substrate.