IP Library Granted Patent US 11,145,966
Granted Patent B2
US 11,145,966 · App. 16/554,080 · Granted Oct 12, 2021

Over-molded thin film antenna device

Inventors: Francisco X. Gomez (West Chicago, IL); Calin Pod (Crystal Lake, IL)
Assignee: PCTEL, Inc.
H01Q1/50B29C45/14065H01P3/081H03F3/19H05K1/18B29K2105/0097B29L2031/3456H03F2200/294H03F2200/451H05K2201/09027H05K2201/10189
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Quick Facts
Patent No.
US 11,145,966
App. No.
16/554,080
Granted
Oct 12, 2021
Kind
B2
Abstract

An over-molded thin film antenna device is provided that can include a core mandrel having a body and a lip, a thin film radio frequency (RF) element wrapped around and supported by the body, an RF connector electrically coupled to the thin film RF element, and an outer layer molded between shutoff surfaces of the core mandrel and over the thin film RF element. The lip can extend over a top of a portion of the thin film RF element to secure the portion of the thin film radio frequency element between the body and the lip.

Claims (32)

1. An antenna device comprising:

a core mandrel having a body and a lip;

a thin film radio frequency (RF) element wrapped around and supported by the body, wherein the lip extends over a top of a portion of the thin film RF element to secure the portion of the thin film RF element between the body and the lip;

an RF connector electrically coupled to the thin film RF element; and

an outer layer molded between shutoff surfaces of the core mandrel and over the thin film RF element.

2. The antenna device of claim 1 further comprising:

a printed circuit board electrically coupled to the RF connector; and

a low noise amplifier circuit electrically coupled to the printed circuit board,

wherein the low noise amplifier circuit is housed inside of the core mandrel, and

wherein the thin film RF element is electrically coupled to the RF connector through the printed circuit board and the low noise amplifier circuit.

3. The antenna device of claim 1 further comprising:

a microstrip line coupling the thin film RF element directly to the RF connector.

4. The antenna device of claim 1 further comprising:

a high bond temperature resistant tape layer and ground trace soldering securing the thin film RF element to the body.

5. The antenna device of claim 1 further comprising:

a cap of the core mandrel solvent bonded to the body,

wherein the cap includes the lip and at least some of the shutoff surfaces.

6. The antenna device of claim 1 wherein the body is hollow.

7. The antenna device of claim 1 wherein the body is solid.

8. The antenna device of claim 1 wherein the core mandrel is one of Acrylonitrile Butadiene Styrene, nylon, ceramic, Polycarbonate, Fluorinated ethylene propylene, or polytetrafluoroethylene.

9. The antenna device of claim 1 wherein the outer layer includes a solidified polymer adhesive hybrid resin.

10. The antenna device of claim 1 further comprising:

a base cap surrounding the RF connector and an end of the core mandrel,

wherein the outer layer is molded over the base cap.

11. A core mandrel comprising:

a body configured to support a thin film radio frequency (RF) element; and

a cap configured to establish a material flow of a resin at a gate of a mold when the body and the cap are located in a cavity of the mold,

wherein the cap includes a lip configured to extend over a top of a portion of the thin film RF element to secure the portion of the thin film RF element between the body and the cap and to prevent the resin from flowing onto an underside of the thin film RF element.

12. The core mandrel of claim 11 wherein the cap is solvent bonded to the body.

13. The core mandrel of claim 11 wherein the body is hollow.

14. The core mandrel of claim 11 wherein the body is solid.

15. The core mandrel of claim 11 wherein the body and the cap are one of Acrylonitrile Butadiene Styrene, nylon, ceramic, Polycarbonate, Fluorinated ethylene propylene, or polytetrafluoroethylene.

Assignments (2)
CHANGE OF NAME Recorded May 20, 2021
From: PC-TEL, INC.
To: PCTEL, INC.
Reel/Frame 056322/0326 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2019
From: GOMEZ, FRANCISCO X.; POD, CALIN
To: PC-TEL, INC.
Reel/Frame 050203/0173 →