Dresser, polishing device, and method of dressing polishing pad
A dresser includes a main body having a stepped surface comprising a plurality of steps, wherein a thickness of the main body at a first step of the plurality of steps is a largest thickness of the main body, and a thickness of the main body at a last step of the plurality of steps is a smallest thickness of the main body; and a plurality of superhard particles disposed on each of the plurality of steps of the stepped surface. The plurality of steps of the stepped surface are different in area, and particle diameters of the superhard particles increase stepwise from the first step of the plurality of steps to the last step of the plurality of steps.
1. A dresser comprising:
a main body having a stepped surface comprising a plurality of steps, wherein a thickness of the main body at a first step of the plurality of steps is a largest thickness of the main body, and a thickness of the main body at a last step of the plurality of steps is a smallest thickness of the main body; and
a plurality of superhard particles disposed on each of the plurality of steps of the stepped surface,
wherein the plurality of steps of the stepped surface are different in area, and respective particle diameters of the superhard particles increase stepwise from the first step of the plurality of steps to the last step of the plurality of steps, the plurality of steps comprises the first step having a first surface, a second step adjacent to the first step and having a second surface, and a third step adjacent to the second step and having a third surface,
the third step is the last step, and
the particle diameters increase in sequence of the superhard particles disposed on the first surface, the superhard particles disposed on the second surface, and the superhard particles disposed on the third surface,
in plan view, the first surface is circular, and the second surface and the third surface are annular, an area of the first surface is larger than an area of the second surface, and the area of the first surface is larger than an area of the third surface, an area of the third surface is larger than an area of the second surface, and
in plan view, the second surface is positioned in periphery of the first surface and the third surface is positioned in periphery of the second surface.
2. A method of dressing a polishing pad using the dresser according to claim 1 , the method comprising increasing a load applied to the dresser such that an operating circumference of the dresser or the polishing pad increases.
3. The dresser according to claim 1 , wherein the superhard particles comprise diamonds.
4. The dresser according to claim 1 , wherein in side view, a number of the superhard particles disposed on the first surface is more than a number of the superhard particles disposed on the second surface.
5. The dresser according to claim 4 , wherein in side view, the number of the superhard particles disposed on the second surface is more than a number of the superhard particles disposed on the third surface.
6. The dresser according to claim 5 , wherein the superhard particles comprise diamonds.
7. The dresser according to claim 4 , wherein the superhard particles comprise diamonds.