Semiconductor storage device with columnar body having impurity containing channel film
A semiconductor storage device includes a stacked body and a columnar body. The stacked body includes a plurality of conductive layers and a plurality of insulating layers that are alternately stacked in a first direction. The columnar body extends through the stacked body in the first direction and includes a core portion, a channel film, a tunnel oxide film, and a charge storage film in this order from a center portion thereof. The channel film has a first region in contact with the core portion and a second region in contact with the tunnel oxide film. The first region is a semiconductor doped with impurities. The second region is a semiconductor. A concentration of the impurities in the second region is lower than that in the first region.
1. A semiconductor storage device comprising:
a stacked body including a plurality of conductive layers and a plurality of insulating layers that are alternately stacked in a first direction; and
a columnar body extending through the stacked body in the first direction and including a core portion, a channel film, a tunnel oxide film, and a charge storage film in this order from a center portion thereof, wherein
the channel film includes at least one element as impurities, and has a first region in contact with the core portion, and a second region in contact with the tunnel oxide film,
the first region is a semiconductor including the impurities, and
the second region is a semiconductor including the impurities, and a concentration of the impurities in the second region is lower than that in the first region.
2. The semiconductor storage device according to claim 1 , wherein the channel film has a first surface in contact with the core portion and a second surface in contact with the tunnel oxide film, the first surface includes the impurities, and the second surface includes the impurities, and a concentration of the impurities in the first surface is higher than a concentration of the impurities in the second surface.
3. The semiconductor storage device according to claim 2 , wherein a concentration of the impurities in the channel film gradually decreases from the first surface to the second surface.
4. The semiconductor storage device according to claim 1 , wherein the channel film is polysilicon having a region including the at least one element as impurities.
5. The semiconductor storage device according to claim 1 , wherein the at least one element is selected from a group consisting of phosphorus, boron, and germanium.
6. The semiconductor storage device according to claim 1 , wherein the at least one element is carbon.
7. The semiconductor storage device according to claim 1 , wherein the concentration of the impurities in the first region is higher than or equal to 1×10 20 /cm 3 and lower than or equal to 1×10 21 /cm 3 .
8. The semiconductor storage device according to claim 1 , wherein the core portion includes the at least one element as impurities in a region in contact with the channel film.
9. The semiconductor storage device according to claim 1 , wherein the concentration of the impurities in the second region is substantially zero.
10. The semiconductor storage device according to claim 1 , wherein the columnar body further includes a block insulating film outside of the charge storage film, and the block insulating film is in contact with the stacked body.