Semiconductor device
A semiconductor device according to an embodiment includes a semiconductor substrate comprising a first face, and a second face on an opposite side to the first face. A semiconductor element is provided on the first face of the semiconductor substrate. A polycrystalline or non-crystalline first material layer is provided at least on an outer edge of the first face of the semiconductor substrate. A second material layer is provided on the second face of the semiconductor substrate. The second material layer transmits laser light.
1. A semiconductor device comprising:
a semiconductor substrate comprising a first face, and a second face on an opposite side to the first face;
a semiconductor element provided on the first face of the semiconductor substrate;
a polycrystalline or non-crystalline first material layer provided at least on an outer edge of the first face of the semiconductor substrate; and
a second material layer provided on the second face of the semiconductor substrate, the second material layer transmitting laser light.
2. The device of claim 1 , wherein the first material layer is provided also between the semiconductor element and the semiconductor substrate.
3. The device of claim 2 , wherein the first material layer includes any of polysilicon, amorphous silicon, a silicon dioxide film, a silicon nitride film, diamond-like carbon, an yttrium oxide, a zirconium oxide, an aluminum oxide, tungsten, and molybdenum.
4. The device of claim 2 , wherein the second material layer transmits of laser light, the laser light having a wavelength of 800 nanometers to 2500 nanometers.
5. The device of claim 2 , wherein the second material layer is higher in a Young's modulus than the semiconductor substrate.
6. The device of claim 2 , wherein the second material layer includes any of a silicon nitride film, diamond-like carbon, an yttrium oxide, a zirconium oxide, and an aluminum oxide.
7. The device of claim 2 , wherein a single modified layer resulting from the laser light is provided on lateral faces of the semiconductor substrate between the first face and the second face.
8. The device of claim 1 , wherein the first material layer includes any of polysilicon, amorphous silicon, a silicon dioxide film, a silicon nitride film, diamond-like carbon, an yttrium oxide, a zirconium oxide, an aluminum oxide, tungsten, and molybdenum.
9. The device of claim 8 , wherein the second material layer transmits of laser light, the laser light having a wavelength of 800 nanometers to 2500 nanometers.
10. The device of claim 8 , wherein the second material layer is higher in a Young's modulus than the semiconductor substrate.
11. The device of claim 8 , wherein the second material layer includes any of a silicon nitride film, diamond-like carbon, an yttrium oxide, a zirconium oxide, and an aluminum oxide.
12. The device of claim 8 , wherein a single modified layer resulting from the laser light is provided on lateral faces of the semiconductor substrate between the first face and the second face.
13. The device of claim 1 , wherein the second material layer transmits of laser light, the laser light having a wavelength of 800 nanometers to 2500 nanometers.
14. The device of claim 1 , wherein the second material layer is higher in a Young's modulus than the semiconductor substrate.
15. The device of claim 1 , wherein the second material layer includes any of a silicon nitride film, diamond-like carbon, an yttrium oxide, a zirconium oxide, and an aluminum oxide.
16. The device of claim 1 , wherein a single modified layer resulting from the laser light is provided on lateral faces of the semiconductor substrate between the first face and the second face.
17. The device of claim 16 , wherein the modified layer is provided on the lateral faces substantially in parallel to outer edges of the first and second faces.
18. The device of claim 1 , wherein the first material layer does not have a crystal orientation in a specific direction.