Semiconductor device with aligned vias

1. A semiconductor device, comprising:

a first via provided in an insulating layer;

a first metal wiring provided on the first via;

a second metal wiring spaced apart from the first metal wiring by an air gap; and

a second via provided on the first metal wiring,

wherein a first side surface of the first metal wiring and a first side surface of the second via are aligned along a first direction, and

wherein an upper surface of the first via includes a notch.

2. The semiconductor device according to claim 1 , wherein a barrier metal is provided between the second via and the first metal wiring.

3. The semiconductor device according to claim 2 , wherein the barrier metal is provided on a second side surface of the second via.

4. The semiconductor device according to claim 1 , wherein the first via, the first metal wiring and the second via include an identical metal material.

5. The semiconductor device according to claim 1 , wherein a second side surface of the first metal wiring and a second side surface of the second via are aligned along the first direction.

6. The semiconductor device according to claim 1 , further comprising one or more other metal wirings, the one or more metal wirings and the first metal wiring spaced from each other at an equal interval in the second direction.

7. The semiconductor device according to claim 1 , wherein the first via is electrically connected to a memory element film penetrating a stacked body in which an electrode layer and an insulating layer are alternately stacked on the semiconductor substrate.

8. The semiconductor device according to claim 1 , wherein the first via is electrically connected to a transistor formed on the semiconductor substrate.

9. The semiconductor device according to claim 1 , wherein the second via is made of a single metal.

10. The semiconductor device according to claim 9 , wherein the second via is in direct contact with the first metal wiring.

11. The semiconductor device according to claim 9 , wherein the second via and the first metal wiring are both part of a continuous metal film.

12. A method, comprising:

forming an insulating layer on a substrate;

forming a hole extending through the insulating layer;

forming a metal film over the insulating layer to form a first via in the hole;

forming a second via in an upper portion of the metal film; and

etching the metal film and the second via to simultaneously form a first space and a second space reaching to the insulating layer,

wherein a side surface of the second via is aligned with a side surface of at least one of the first or second spaces along a first direction, and

wherein an upper surface of the first via includes a notch.

13. The method of claim 12 , further comprising:

forming an insulating layer over the etched metal film to form a metal wiring between the first and second spaces.

14. The method of claim 12 , wherein the second via is made of a single metal.

15. A semiconductor device, comprising:

a stack body having an electrode layer and an insulating layer that are alternately stacked;

a first via provided on the stack body;

a first metal wiring provided on the first via; and

a second via provided on the first metal wiring,

wherein a first side surface of the first metal wiring and a first side surface of the second via are aligned along a first direction, the first via is electrically connected to a memory element film penetrating a stacked body, and wherein an upper surface of the first via includes a notch.

16. The semiconductor device according to claim 15 , wherein the second via is made of a single metal.

17. The semiconductor device according to claim 16 , wherein the second via is in direct contact with the first metal wiring.

18. The semiconductor device according to claim 16 , wherein the second via and the first metal wiring are both part of a continuous metal film.