Semiconductor device
According to one embodiment, a semiconductor device includes: a printed wiring substrate that includes a substrate, a wiring layer on the substrate, and a first insulating layer on the wiring layer. The wiring layer includes a connection terminal and a wiring electrically connected to the connection terminal. The first insulating layer includes an opening that exposes at least a portion of the connection terminal and at least a portion of the wiring, and at least one of a protrusion portion or a recess portion, provided along an edge of the opening, that overlaps the wiring. The semiconductor device includes a semiconductor chip mounted on the printed wiring substrate; a bonding wire that electrically connects the connection terminal and the semiconductor chip; and a second insulating layer that covers the semiconductor chip, the bonding wire, and the opening.
1. A semiconductor device comprising:
a printed wiring substrate including
a substrate,
a wiring layer provided on the substrate, and
a first insulating layer provided on the wiring layer,
wherein the wiring layer includes a connection terminal and a wiring electrically connected to the connection terminal, and
wherein the first insulating layer that includes an opening that exposes at least a portion of the connection terminal and at least a portion of the wiring, and at least one of a protrusion portion or a recess portion, provided along a first edge of the opening, that overlaps the wiring;
a semiconductor chip mounted on the printed wiring substrate;
a bonding wire that electrically connects the connection terminal to the semiconductor chip; and
a second insulating layer that covers the semiconductor chip, the bonding wire, and the opening.
2. The semiconductor device according to claim 1 , wherein
a linear expansion coefficient of the second insulating layer is greater than a linear expansion coefficient of the first insulating layer.
3. The semiconductor device according to claim 1 , wherein
the first insulating layer is a solder resist, and
the second insulating layer is a die attach film.
4. The semiconductor device according to claim 1 , wherein
the first insulating layer further includes a flat portion provided along at least one of the first edge or a second, different edge of the opening.
5. The semiconductor device according to claim 1 , wherein
the wiring layer further includes a dummy wiring, and
the opening exposes a portion of the dummy wiring.
6. The semiconductor device according to claim 5 , wherein
the first insulating layer includes the protrusion portion,
the wiring and the dummy wiring are juxtaposed along a first direction, and
at least one of ends of the dummy wiring is separated from both ends of the protrusion portion along the first direction.
7. The semiconductor device according to claim 1 , further comprising:
one or more semiconductor chips provided on the second insulating layer; and
a third insulating layer covering the one or more semiconductor chips and the substrate.
8. The semiconductor device according to claim 7 , wherein the third insulating layer includes an inorganic filler.
9. The semiconductor device according to claim 7 , wherein the inorganic filler includes at least one of: SiO2, aluminum hydroxide, calcium carbonate, aluminum oxide, boron nitride, titanium oxide, or barium titanate.
10. The semiconductor device according to claim 1 , wherein a linear expansion coefficient of the second insulating layer is about 100 ppm/° C., and a linear expansion coefficient of the first insulating layer is about 30 ppm/° C.
11. A semiconductor device comprising:
a substrate;
a wiring layer provided on the substrate; and
a first insulating layer provided on the wiring layer,
wherein the wiring layer includes a connection terminal and a wiring electrically connected to the connection terminal,
and wherein the first insulating layer includes an opening that exposes the connection terminal and a portion of the wiring, and at least one of a protrusion portion or a recess portion, provided along at least one edge of the opening, that overlaps the wiring.
12. The semiconductor device according to claim 11 , further comprising:
a semiconductor chip mounted on the substrate;
a bonding wire that electrically connects the connection terminal to the semiconductor chip; and
a second insulating layer that covers the semiconductor chip, the bonding wire, and the opening.
13. The semiconductor device according to claim 12 , wherein a linear expansion coefficient of the second insulating layer is greater than a linear expansion coefficient of the first insulating layer.