Semiconductor storage device and method of manufacturing the same
View Patent ↗A semiconductor storage device includes a first chip bonded to a second chip. The first chip includes electrode layers stacked in a first direction, a pillar extending through the stacked electrode layers and including a semiconductor film, and a memory film between the semiconductor film and the electrode layers. The second chip includes a semiconductor substrate having transistors formed thereon, a wiring connected to the transistors and between the semiconductor substrate and the first chip, bonding pads at a level closer to the first chip than the transistors. The bonding pads have a bonding surface facing away from the first chip. An opening extends through the semiconductor substrate to the bonding surface of the bonding pad.
1. A semiconductor storage device, comprising:
a first chip;
a second chip bonded to the first chip, wherein
the first chip comprises:
a plurality of electrode layers stacked in a first direction;
a pillar extending in the first direction through the plurality of electrode layers and including a semiconductor film; and
a memory film between the semiconductor film and the plurality of electrode layers; and
the second chip comprises:
a semiconductor substrate;
a plurality of transistors on the semiconductor substrate;
a wiring connected to the transistors and being between the transistors and the first chip in the first direction;
a bonding pad at a level closer to the first chip in the first direction than the transistors, the bonding pad having a bonding surface facing away from the first chip in the first direction; and
an opening extending through the semiconductor substrate to the bonding surface of the bonding pad; and
the semiconductor storage device further comprises:
a plurality of first pads on the first chip facing the second chip and electrically connected to the wiring and an end of the semiconductor film; and
a plurality of second pads disposed on the second chip facing the first chip, one of the plurality of the second pads overlapping the bonding pad in the first direction.
2. The semiconductor storage device according to claim 1 , wherein the second chip further comprises a dummy pad between the bonding pad and one of the first pads.
3. The semiconductor storage device according to claim 1 , wherein the bonding pad is opposite a cell array region of the first chip including a plurality of memory pillars.
4. The semiconductor storage device according to claim 1 , wherein the bonding pad is opposite a peripheral region of the first chip comprising a region outside a memory cell array region of the first chip.
5. The semiconductor storage device according to claim 4 , wherein the peripheral region is between two memory cell array regions of the first chip.
6. The semiconductor storage device according to claim 1 , wherein the bonding pad is at a same level along the first direction as the wiring.
7. The semiconductor storage device according to claim 1 , wherein
the bonding pad comprises tungsten, and
an aluminum layer is on a wire bonding surface of the bonding pad.
8. A method of manufacturing a semiconductor storage device, the method comprising:
stacking a first chip and a second chip,
the first chip comprising:
a plurality of electrode layers stacked in a first direction;
a pillar extending in the first direction through the plurality of electrode layers and including a semiconductor film; and
a memory film between the semiconductor film and the plurality of electrode layers; and
the second chip comprising:
a semiconductor substrate;
a plurality of transistors on the semiconductor substrate;
a wiring connected to the transistors, the wiring being between transistors and the first chip in the first direction when the first and second chips are stacked;
a bonding pad at a level closer to the first chip in the first direction than the transistors, the bonding pad having a bonding surface facing away from the first chip in the first direction; and
an opening extending through the semiconductor substrate to the bonding surface of the bonding pad, wherein
the first chip further comprises a first pad facing the second chip and electrically connected to the wiring and an end of the semiconductor films, and
the second chip further comprises a second pad facing the first chip, the second pad overlapping at least a portion of the bonding pad in the first direction.
9. The method according to claim 8 , further comprising:
bonding a bonding wire to the bonding surface of the bonding pad.
10. The method according to claim 8 , wherein the bonding pad is at a same level in the second chip as the wiring.
11. The method according to claim 8 , wherein the bonding pad includes an aluminum layer on the bonding surface.