Gate structure and method of forming same

1. A method comprising:

forming a sacrificial gate over an active region of a substrate;

removing the sacrificial gate to form an opening;

forming a gate dielectric layer on sidewalls and a bottom of the opening;

forming a first work function layer over the gate dielectric layer in the opening;

forming a first protective layer over the first work function layer in the opening, wherein the first protective layer covers a surface of the first work function layer outside the opening, and wherein the first protective layer partially fills the opening;

after forming the first protective layer, performing a first etch process to widen an upper portion of the opening; and

filling the opening with a conductive material, wherein at least a portion of the first protective layer remains in the opening after filling the opening with the conductive material.

2. The method of claim 1 , further comprising forming a second work function layer between the gate dielectric layer and the first work function layer.

3. The method of claim 1 , further comprising:

before forming the first work function layer, forming a second protective layer on exposed surfaces the gate dielectric layer; and

after forming the second protective layer and before forming the first work function layer, performing a second etch process to widen the upper portion of the opening.

4. The method of claim 1 , further comprising, after performing the first etch process and before filling the opening with the conductive material, forming a second protective layer in the opening.

5. The method of claim 1 , wherein the first etch process removes a partial portion of the first protective layer.

6. The method of claim 5 , wherein the first etch process further removes a partial portion of the first work function layer.

7. The method of claim 5 , wherein a thickness of an upper portion of the first protective layer becomes narrower after removing the partial portion of the first protective layer.

8. A method comprising:

forming a sacrificial gate over an active region of a substrate;

removing the sacrificial gate to form a first opening;

forming a gate dielectric layer on sidewalls and a bottom of the first opening;

forming a first work function layer over the gate dielectric layer in the first opening;

filling the first opening with a sacrificial layer, wherein a width of the sacrificial layer increases as the sacrificial layer extends from a top of the first opening toward the bottom of the first opening;

etching back the sacrificial layer to expose an upper portion of the first work function layer within the first opening;

removing the upper portion of the first work function layer to expose an upper portion of the gate dielectric layer within the first opening;

removing a remaining portion of the sacrificial layer;

filling the first opening with a conductive material;

patterning the gate dielectric layer, the first work function layer, and the conductive material to form a second opening, wherein the second opening comprises a top portion having a first width and a bottom portion having a second width, wherein the first width is greater than the second width, and wherein the second opening extends through the gate dielectric layer, the first work function layer, and the conductive material; and

filling the second opening with a dielectric material, wherein a bottommost surface of the gate dielectric layer is above a bottommost surface of the dielectric material.

9. The method of claim 8 , further comprising, before forming the first work function layer, forming a second work function layer on exposed surfaces of the gate dielectric layer, the first work function layer and the second work function layer being work function layers of different types.

10. The method of claim 9 , further comprising removing a portion of the second work function layer interposed between the upper portion of the gate dielectric layer and the upper portion of the first work function layer.

11. The method of claim 9 , wherein the first work function layer is an N-type work function layer, and wherein the second work function layer is a P-type work function layer.

12. The method of claim 8 , wherein removing the upper portion of the first work function layer comprises performing a wet etching process.

13. The method of claim 8 , wherein removing the remaining portion of the sacrificial layer comprises performing a plasma process.

14. The method of claim 8 , further comprising:

before forming the first work function layer, depositing a second work function layer on exposed surfaces of the gate dielectric layer in the first opening; and

before forming the first work function layer, removing the second work function layer from the first opening.

15. A method comprising:

forming a sacrificial gate over an active region of a substrate;

removing the sacrificial gate to form an opening, the opening exposing the active region;

depositing a gate dielectric layer on sidewalls and a bottom of the opening;

depositing a first work function layer over the gate dielectric layer in the opening;

depositing a first protective layer over the first work function layer in the opening, wherein the first protective layer partially fills the opening;

after depositing the first protective layer, removing a portion of the first protective layer to expose a first portion of the first work function layer deposited along upper portions of the sidewalls of the opening, wherein a second portion of the first work function layer deposited along lower portions of the sidewalls of the opening is covered by a remaining portion of the first protective layer; and

filling the opening with a conductive material, wherein the remaining portion of the first protective layer remains in the opening after filling the opening with the conductive material.

16. The method of claim 15 , wherein removing the portion of the first protective layer comprises performing an etch process on the first protective layer.

17. The method of claim 15 , further comprising:

before depositing the first work function layer, depositing a second protective layer over the gate dielectric layer in the opening; and

before depositing the first work function layer, removing a portion of the second protective layer to expose a first portion of the gate dielectric layer deposited along the upper portions of the sidewalls of the opening, wherein a second portion of the gate dielectric layer deposited along the lower portions of the sidewalls of the opening is covered by a remaining portion of the second protective layer.

18. The method of claim 17 , wherein removing the portion of the second protective layer comprises performing an etch process on the second protective layer.

19. The method of claim 15 , further comprising, before filling the opening with the conductive material, depositing a second protective layer over the first protective layer in the opening, the second protective layer being in physical contact with the first protective layer and the first work function layer.

20. The method of claim 15 , further comprising, before depositing the first work function layer, depositing a second work function layer over the gate dielectric layer in the opening.