Semiconductor device
View Patent ↗A semiconductor device according to embodiments includes: a first conductivity-type first semiconductor layer set to a first potential; a second conductivity-type second semiconductor layer stacked on the first semiconductor layer and set to a second potential; an interlayer insulating film disposed on a main surface of the second semiconductor layer; a resistor disposed above the first semiconductor layer while interposing the second semiconductor layer and the interlayer insulating film therebetween; and a terminal electrically connected to the second semiconductor layer.
1. A semiconductor device comprising:
a first conductivity-type first semiconductor layer set to a first potential;
a second conductivity-type second semiconductor layer stacked on the first semiconductor layer and set to a second potential;
an interlayer insulating film disposed on a main surface of the second semiconductor layer; and
a resistor disposed above the first semiconductor layer while interposing the second semiconductor layer and the interlayer insulating film therebetween; and
a terminal electrically connected to the second semiconductor layer.
2. The semiconductor device according to claim 1 , wherein the second potential is the first potential or an intermediate potential between the first potential and a potential of the resistor, and a potential difference between the first potential and the second potential is smaller than a withstand voltage of a pn junction formed on an interface between the first semiconductor layer and the second semiconductor layer.
3. The semiconductor device according to claim 1 , wherein the resistor is a semiconductor film doped with impurities.
4. The semiconductor device according to claim 1 ,
wherein a plurality of the resistors are connected with one another to form a single combined resistor, and
the second semiconductor layer is electrically connected to any of the plurality of resistors, and the second semiconductor layer is set to the second potential.
5. The semiconductor device according to claim 4 , wherein the plurality of resistors having a same shape and arranged periodically are connected with one another to form the combined resistor.
6. The semiconductor device according to claim 4 , wherein any of mutual connection points of the plurality of resistors and the second semiconductor layer are electrically connected to each other.
7. The semiconductor device according to claim 4 , wherein the combined resistor is formed by alternately connecting the resistors and wires disposed on an upper surface of an insulating film formed above the resistors.
8. The semiconductor device according to claim 1 , wherein an upper surface of the second semiconductor layer has an irregular shape in which a depth of a recess is 100 nm to 600 nm, and the resistor is disposed above a protrusion of the upper surface of the second semiconductor layer.
9. The semiconductor device according to claim 8 , wherein the terminal is disposed on an upper surface of the interlayer insulating film and electrically connected to the protrusion on the upper surface of the second semiconductor layer via a via penetrating the interlayer insulating film.
10. The semiconductor device according to claim 1 , wherein the second potential is closer to a potential of the resistor than the first potential is.
11. The semiconductor device according to claim 1 , wherein a periphery of a lower portion of the second semiconductor layer is surrounded by the first semiconductor layer.
12. The semiconductor device according to claim 1 , wherein a film thickness of the interlayer insulating film below the resistor is 13 nm to 50 nm.
13. The semiconductor device according to claim 1 , wherein the resistor is a polysilicon film doped with impurities and having a film thickness of 40 nm to 400 nm.