IP Library Granted Patent US 11,087,809
Granted Patent B2
US 11,087,809 · App. 16/565,274 · Granted Aug 10, 2021

Semiconductor memory device

Inventor: Akira Katayama (Yokohama Kanagawa, JP)
Assignee: TOSHIBA MEMORY CORPORATION
G11C11/161G11C11/1655G11C11/1657G11C11/1673G11C11/1675
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Quick Facts
Patent No.
US 11,087,809
App. No.
16/565,274
Granted
Aug 10, 2021
Kind
B2
Abstract

According to one embodiment, a semiconductor memory device comprising: a first memory layer including a plurality of memory units electrically coupled to one another; a first memory area including a first memory unit for data writing of the memory units; a second memory area including a second memory unit for data reading of the memory units; and a controller configured to write data in the first memory unit, shift the data written in the first memory unit to the second memory unit, and read data written in the second memory unit.

Claims (55)

1. A semiconductor memory device comprising:

a first memory layer including a plurality of memory units electrically coupled to one another;

a first memory area including a first memory unit for data writing of the memory units;

a second memory area including second memory units for data reading of the memory units; and

a controller configured to write data in the first memory unit, shift the data written in the first memory unit to the second memory units, and read the data shifted to the second memory units.

2. The semiconductor memory device according to claim 1 , wherein:

when writing first data in the first memory unit, the controller:

writes the first data in the first memory unit,

shifts the first data to a third memory unit adjacent to the first memory unit, and

writes second data for determining the first data in the first memory unit.

3. The semiconductor memory device according to claim 1 , wherein:

when reading first data stored in one of the second memory units, the controller:

obtains first information concerning the first data stored in the one of the second memory units,

shifts second data for determining the first data and stored in a third memory unit adjacent to the one of the second memory units to the one of the second memory units, and shifts the first data to a fourth memory unit adjacent to the one of the second memory units,

obtains second information concerning the second data shifted to the one of the second memory units,

shifts the second data shifted to the one of the second memory units to the third memory unit, and shifts the first data shifted to the fourth memory unit to the one of the second memory units, and

determines the first data based on the first information and the second information.

4. The semiconductor memory device according to claim 3 , wherein each of the first information and the second information is a voltage or a current.

5. The semiconductor memory device according to claim 2 , wherein the second data is inverted data of the first data.

6. The semiconductor memory device according to claim 3 , wherein the second data is inverted data of the first data.

7. The semiconductor memory device according to claim 4 , wherein the second data is inverted data of the first data.

8. The semiconductor memory device according to claim 1 , further comprising:

a second memory layer including a plurality of memory units electrically coupled to one another, wherein

when receiving a read command for the first memory layer, and receiving a write command for the second memory layer, the controller simultaneously performs a read operation on the first memory layer and a write operation on the second memory layer.

9. The semiconductor memory device according to claim 2 , further comprising:

a second memory layer including a plurality of memory units electrically coupled to one another, wherein

when receiving a read command for the first memory layer, and receiving a write command for the second memory layer, the controller simultaneously performs a read operation on the first memory layer and a write operation on the second memory layer.

10. The semiconductor memory device according to claim 3 , further comprising:

a second memory layer including a plurality of memory units electrically coupled to one another, wherein

when receiving a read command for the first memory layer, and receiving a write command for the second memory layer, the controller simultaneously performs a read operation on the first memory layer and a write operation on the second memory layer.

11. The semiconductor memory device according to claim 4 , further comprising:

a second memory layer including a plurality of memory units electrically coupled to one another, wherein

when receiving a read command for the first memory layer, and receiving a write command for the second memory layer, the controller simultaneously performs a read operation on the first memory layer and a write operation on the second memory layer.

12. The semiconductor memory device according to claim 5 , further comprising:

a second memory layer including a plurality of memory units electrically coupled to one another, wherein

when receiving a read command for the first memory layer, and receiving a write command for the second memory layer, the controller simultaneously performs a read operation on the first memory layer and a write operation on the second memory layer.

13. The semiconductor memory device according to claim 1 , wherein the first memory area includes:

a first magnetoresistive effect element including the first memory unit and a first reference layer; and

a first select transistor.

14. The semiconductor memory device according to claim 13 , wherein the first select transistor in the first memory area includes one end coupled to one end of the first magnetoresistive effect element, and another end coupled to a first bit line.

15. The semiconductor memory device according to claim 14 , wherein the first bit line coupled to the first memory area is not coupled to a sense amplifier for reading data.

16. The semiconductor memory device according to claim 1 , wherein:

the second memory area includes:

second magnetoresistive effect elements each including one of the second memory units and a second reference layer; and

second select transistors.

17. The semiconductor memory device according to claim 16 , wherein each second select transistor in the second memory area includes one end coupled to one end of a corresponding one of the second magnetoresistive effect elements, and another end coupled to a second bit line.

18. The semiconductor memory device according to claim 17 , wherein the second bit line coupled to the second memory area is coupled to a sense amplifier for reading data.

19. The semiconductor memory device according to claim 1 , wherein:

the first memory area includes:

a first magnetoresistive effect element including the first memory unit and a first reference layer; and

a first select transistor, and

the second memory area includes:

second magnetoresistive effect elements each including one of the second memory units and a second reference layer; and

second select transistors.

20. The semiconductor memory device according to claim 19 , wherein a first word line coupled to a gate of the first select transistor differs from a second word line coupled to gates of the second select transistors.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058905/0582 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2019
From: KATAYAMA, AKIRA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 050885/0286 →