IP Library Granted Patent US 10,957,404
Granted Patent B2
US 10,957,404 · App. 16/567,982 · Granted Mar 23, 2021

Memory device which generates operation voltages in parallel with reception of an address

Inventors: Akio Sugahara (Yokohama Kanagawa, JP); Takaya Handa (Yokohama Kanagawa, JP); Ryosuke Isomura (Matsudo Chiba, JP); Kazuto Uehara (Sagamihara Kanagawa, JP); Junichi Sato (Yokohama Kanagawa, JP); Norichika Asaoka (Yokohama Kanagawa, JP); Masashi Yamaoka (Yokohama Kanagawa, JP); Bushnaq Sanad (Yokohama Kanagawa, JP); Yuzuru Shibazaki (Fujisawa Kanagawa, JP); Noriyasu Kumazaki (Kawasaki Kanagawa, JP); Yuri Terada (Yokohama Kanagawa, JP)
Assignee: TOSHIBA MEMORY CORPORATION
G11C16/30G11C16/0483G11C16/08G11C16/32G11C16/12G11C16/26H01L27/115
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Quick Facts
Patent No.
US 10,957,404
App. No.
16/567,982
Granted
Mar 23, 2021
Kind
B2
Abstract

According one embodiment, a memory device includes: a memory cell array; a voltage generation circuit generating one or more voltages supplied to the memory cell array; an input/output circuit receiving an address indicating a region in the memory cell array; and a control circuit controlling operations of the memory cell array. The voltage generation circuit generates the voltages during reception of the address.

Claims (49)

1. A memory device comprising:

a memory cell array;

a voltage generation circuit generating one or more voltages supplied to the memory cell array;

an input/output circuit receiving an address indicating a region in the memory cell array; and

a control circuit controlling operations of the memory cell array,

wherein the voltage generation circuit generates the voltages in parallel with reception of the address.

2. The memory device according to claim 1 , further comprising:

a plurality of blocks provided in the memory cell array,

wherein:

the address includes a word line address and a block address received after the word line address,

the voltages are supplied to the blocks when the word line address is received, and

supply of the voltages to one or more non-selected blocks other than the selected block corresponding to the block address in the blocks is stopped when the block address is received, based on the block address.

3. The memory device according to claim 1 , further comprising:

a row control circuit activated with a first signal and controlling rows of the memory cell array,

wherein a signal level of the first signal is changed from a first level to a second level in a period in which a ready/busy signal indicates a ready state.

4. The memory device according to claim 3 , wherein the row control circuit performs calculation processing using the first signal and the address, and controls a signal level of a second signal selecting one block corresponding to the address in the blocks of the memory cell array, based on a result of the calculation processing.

5. The memory device according to claim 3 , wherein the signal level of the first signal is set at the second level after reception of the address.

6. The memory device according to claim 3 , wherein the row control circuit starts supply of the voltages in response to the second level of the first signal.

7. The memory device according to claim 1 , wherein:

the control circuit starts supply of the voltages to the memory cell array based on a first command received before the address, and

the control circuit performs an operation to the memory cell array based on a second command received between the first command and the address.

8. The memory device according to claim 1 , wherein:

the control circuit supplies the voltages to a plurality of word lines of the memory cell array during reception of the address, and

after reception of a word line address in the address, the control circuit stops supply of a first voltage of the voltages to a selected word line corresponding to the word line address and continues supply of the voltages to one or more unselected word lines other than the selected word line.

9. The memory device according to claim 1 , wherein:

a current flows in an interconnect connected to the memory cell array,

the current has a first current value in a first period of reception of the address,

the current has a second current value in a second period in which the voltages are supplied to the memory cell array, and

the first current value is higher than the second current value.

10. The memory device according to claim 9 , wherein:

the current has a third current value in a third period in which a ready/busy signal indicates a busy state, and

the third current value is equal to or less than the second current value.

11. The memory device according to claim 1 , further comprising:

a temperature sensor measuring a temperature of a chip including the memory cell array,

wherein the control circuit uses the temperature measured before reception of the address, to set voltage values of the voltages generated with the voltage generation circuit.

12. The memory device according to claim 11 , wherein:

the temperature sensor acquires a first temperature in a period in which an operation of a first command corresponding to the address is executed, and

the control circuit executes an operation of a second command supplied after the operation of the first command using the voltage values of the voltages set based on the first temperature.

13. The memory device according to claim 11 , wherein the temperature sensor periodically measures the temperature in a first period in which a ready/busy signal indicates a ready state and a second period in which a ready/busy signal indicates a busy state.

14. The memory device according to claim 1 , further comprising:

a driver circuit transferring the voltages to the memory cell array based on a third signal from the control circuit,

wherein the third signal is activated during reception of the address.

15. The memory device according to claim 14 , wherein:

the driver circuit transfers a second voltage of the voltages to the memory cell array in a period in which a signal level of the third signal is a first level, the second voltage having a first voltage value,

the driver circuit transfers a third voltage of the voltages to the memory cell array in response to a timing in which the signal level of the third signal changes from the first level to a second level, the third voltage having a second voltage value higher than the first voltage value, and

the driver circuit transfers a fourth voltage of the voltages to the memory cell array in response to a timing in which the signal level of the third signal changes from the second level to the first level, the fourth voltage having a third voltage value being equal to or higher than the second voltage value.

16. The memory device according to claim 1 , wherein the control circuit speculatively starts supply of the voltages to the memory cell array before completion of decoding of the address.

17. The memory device according to claim 1 , wherein the control circuit starts supply of the voltages to the memory cell array at a timing self-aligned to completion of decoding of the address.

18. The memory device according to claim 1 , wherein the memory cell array includes a memory cell including a charge storage layer.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058905/0582 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2019
From: SUGAHARA, AKIO; HANDA, TAKAYA; ISOMURA, RYOSUKE; UEHARA, KAZUTO; SATO, JUNICHI; ASAOKA, NORICHIKA; YAMAOKA, MASASHI; SANAD, BUSHNAQ; SHIBAZAKI, YUZURU; KUMAZAKI, NORIYASU; TERADA, YURI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051183/0146 →