Display panel motherboard, display panel and method of manufacturing the same

1. A display panel motherboard, comprising a plurality of display substrates, wherein the display substrate comprises:

an organic light emitting unit;

an array substrate, having at least one first area acting as a notch reserved area, and a second area different from the first area, the organic light emitting unit being formed on the array substrate and located on the second area;

a mounting notch penetrating a top and bottom surface of the display substrate;

an encapsulation layer, formed on a side of the organic light emitting unit facing away from the array substrate and covering the notch reserved area, the notch reserved area being substantially free of organic emitting units, the encapsulation layer overlaying a sidewall of the organic light emitting unit adjacent to the mounting notch; and

an etch protection layer formed on a side of the encapsulation layer facing away from the array substrate.

2. The display panel motherboard according to claim 1 , wherein the etch protection layer overlays the second area of the array substrate.

3. The display panel motherboard according to claim 1 , wherein the etch protection layer comprises a transparent material.

4. The display panel motherboard according to claim 1 , wherein the display substrate comprises a display area and a border area surrounding the display area, and

the notch reserved area is positioned within the display area.

5. A display panel, comprising:

an array substrate, provided with at least one mounting notch, the mounting notch extending through the display panel in a direction perpendicular to the array substrate;

an organic light emitting unit, formed on the array substrate and positioned on an area outside the mounting notch;

an encapsulation layer, formed on a side of the organic light emitting unit facing away from the array substrate; and

an etch protection layer, formed on a side of the encapsulation layer facing away from the array substrate;

wherein a periphery of the mounting notch is provided with an encapsulating layer material having a predetermined thickness, and wherein the encapsulating layer material having the predetermined thickness covers at least one of the organic light emitting units adjacent to the periphery of the mounting notch.

6. The display panel according to claim 5 , wherein the etch protection layer comprises a transparent material.

7. The display panel according to claim 5 , wherein the etch protection layer covers at least an area of the display panel other than the mounting notch.

8. A method of manufacturing a display panel, comprising:

providing an array substrate, the array substrate comprising at least one first area acting as a notch reserved area, and a second area different from the first area;

forming an organic light emitting unit on the second area of the array substrate;

forming an encapsulation layer on a side of the organic light emitting unit facing away from the array substrate, the encapsulation layer covering the notch reserved area;

forming an etch protection layer on a side of the encapsulation layer facing away from the array substrate to form a display substrate; and

removing each film layer of the display substrate located within the notch reserved area with an etching process, to form a mounting notch.

9. The method according to claim 8 , wherein the providing the array substrate comprises:

providing a bearing substrate;

forming a base substrate on the bearing substrate; and

forming a thin film transistor, an anode, and a functional film layer sequentially on the base substrate.

10. The method according to claim 9 , wherein the forming the organic light emitting unit on the second area of the array substrate comprises: forming the organic light emitting unit on the functional film layer within the second area.

11. The method according to claim 8 , wherein the etch protection layer comprises a non-transparent material, and the method further comprises removing the etch protection layer.

12. The method according to claim 9 , wherein the forming the thin film transistor, the anode and the functional film layer sequentially on the base substrate further comprises:

forming a buffer layer on the base substrate, prior to the forming the thin film transistor.

13. The method according to claim 9 , wherein the forming the thin film transistor, the anode, and the functional film layer sequentially on the base substrate further comprises:

forming a planarization layer on the formed thin film transistor, to form a planar top surface; and

forming a through hole in the planarization layer, to expose a source electrode and a drain electrode of the thin film transistor.

14. The method according to claim 8 , wherein the organic light emitting unit further comprises a plurality of sub-pixels, the array substrate further comprises a pixel defining layer, the pixel defining layer has a plurality of pixel defining openings, each of the pixel defining openings comprises a plurality of sub-openings, and the forming the organic light emitting unit on the second area of the array substrate further comprises: depositing a light emitting layer for emitting red light, a light emitting layer for emitting green light, and a light emitting layer for emitting blue light on the corresponding plurality of sub-openings in the pixel defining layer respectively with a precision metal mask by an evaporation process, to form the corresponding plurality of sub-pixels.