Batch processing system with vacuum isolation
A vapor deposition system comprises a vacuum chamber and two or more process modules each configured for processing a semiconductor substrate. Each process module is removably connected to a respective port of the vacuum chamber such that each process module is in vacuum communication with the vacuum chamber when connected to the respective port. A port sealing mechanism is configured to create a vacuum seal at each port such that when a first port is sealed and a first process module is disconnected from the first port, a vacuum condition is maintained within the vacuum chamber while the first process module is open to atmospheric pressure.
1. A vapor deposition system comprising:
a vacuum chamber configured to maintain a gaseous pressure less than atmospheric pressure, the vacuum chamber sized to permit transport of two or more semiconductor substrates within the vacuum chamber;
two or more process modules each configured for processing a semiconductor substrate, each process module being removably connected to a respective port of the vacuum chamber such that each process module is in vacuum communication with the vacuum chamber when connected to the respective port, each process module being configured to maintain the gaseous pressure less than atmospheric when connected to the respective port; and
a port sealing mechanism configured to create a vacuum seal at each port such that when a first port is sealed and a first process module corresponding to the first port is disconnected from the first port, a vacuum condition is maintained within the vacuum chamber while the first process module is open to atmospheric pressure,
wherein the port sealing mechanism includes a valve plate that covers the respective port to create the vacuum seal, and
the vapor deposition system further comprising a lifting mechanism configured to selectively lift the valve plate to the first port and lift the semiconductor substrate into the first process module.
2. The vapor deposition system of claim 1 , wherein when the first port is sealed and the first process module is disconnected, semiconductor substrates located within the vacuum chamber remain within the vacuum condition.
3. The vapor deposition system of claim 1 , wherein when the first port is sealed and the first process module is disconnected, a given semiconductor substrate located within a second process module connected to a second port remains at the vacuum condition.
4. The vapor deposition system of claim 1 , wherein at least one process module of the two or more process modules is configured to sputter etch the semiconductor substrate when positioned therein, and wherein at least one process module of the two or more process modules is configured to vapor deposit a film on the semiconductor substrate when positioned therein.
5. The vapor deposition system of claim 1 , wherein each process module is pivotally attached to the vacuum chamber and is removable from the respective port by pivoting each process module away from the respective port of the vacuum chamber.
6. The vapor deposition system of claim 1 , wherein the vapor deposition system is configured to simultaneous process multiple semiconductor wafers using the two or more process modules.
7. The vapor deposition system of claim 1 , further comprising a substrate carrier that transports semiconductor substrates within the vacuum chamber.
8. The vapor deposition system of claim 7 , wherein the substrate carrier has a circular pathway configured to transport the semiconductor substrates among the two or more process modules by rotation.
9. The vapor deposition system of claim 1 , further comprising a locking ring positioned at the respective port and configured to hold the valve plate sealed to the respective port.
10. The vapor deposition system of claim 1 , wherein the two or more process modules includes at least four process modules, wherein at least two process modules of the at least four process modules are configured to sputter etch the semiconductor substrate when positioned therein, and wherein at least two process modules of the at least four process modules are configured to vapor deposit a film on the semiconductor substrate when positioned therein.
11. The vapor deposition system of claim 1 , wherein a single vacuum pump creates the vacuum condition for the vacuum chamber as well as the two or more process modules.
12. A vapor deposition system comprising:
a vacuum chamber;
two or more process modules in vacuum communication with the vacuum chamber;
a valve plate disposed within the vacuum chamber;
a rotatable valve carrier configured to rotate and so transport the valve plate to position the valve plate under a sealing surface of at least one process module; and
a locking ring configured to secure the positioned valve plate against the sealing surface of said at least one process module with sufficient force to maintain vacuum pressure in the vacuum chamber while the at least one process module is removed from vacuum communication with the vacuum chamber to atmospheric pressure.