Enclosure for ion trapping device
Devices, methods, and systems for enclosures for an ion trapping device are described herein. One enclosure for an ion trapping device includes a heat spreader base that includes a perimeter portion and a center portion connected to the perimeter portion by a bridge portion, a grid array coupled to the heat spreader, a spacer with a plurality of studs coupled to the grid array, an interposer and ion trap die coupled to the spacer, a connector coupled to interposer, and a roof portion coupled to the heat spreader base.
1. An enclosure for an ion trapping device, comprising:
a heat spreader base that includes a perimeter portion and a center portion connected to the perimeter portion by a bridge portion;
a grid array coupled to the heat spreader;
a spacer with a plurality of studs coupled to the grid array;
an interposer and ion trap die coupled to the spacer;
a connector coupled to interposer; and
a roof portion coupled to the heat spreader base.
2. The enclosure of claim 1 , wherein the grid array includes a plurality of pins that are positioned between the perimeter portion and the center portion of the heat spreader base.
3. The enclosure of claim 2 , wherein a portion of the plurality of pins are removed at an area that corresponds to the bridge portion of the heat spreader base.
4. The enclosure of claim 1 , wherein the roof portion includes an aperture positioned over the interposer and the ion trap die when the roof portion is coupled to the heat spreader base.
5. The enclosure of claim 1 , wherein the connector includes at least one of: a microwave connector and a radio frequency (RF) connector.
6. The enclosure of claim 1 , wherein the connector is coupled indirectly or directly to the ion trap die.
7. The enclosure of claim 1 , wherein the roof portion provides a space between the roof portion and the heat spreader base when the roof portion is coupled to the heat spreader.
8. A system for trapping ions, comprising:
a vacuum enclosure to provide a vacuum within the vacuum enclosure; and
an ion trapping enclosure within the vacuum enclosure, comprising:
a heat spreader base that includes a perimeter portion and a center portion connected to the perimeter portion by a bridge portion;
a grid array with a plurality of pins coupled to the heat spreader, wherein the plurality of pins are positioned between the perimeter portion and the center portion of the heat spreader base;
an interposer and ion trap die coupled to a spacer; and
a roof portion coupled to the heat spreader base to provide optical access to the ion trap die and prevent stray electric fields from entering an aperture of the roof portion.
9. The system of claim 8 , wherein the roof portion prevents stray electric fields from entering the aperture of the roof portion via a copper mesh covering the aperture.
10. The system of claim 8 , wherein the plurality of pins of the grid array are coupled to circuitry.
11. The system of claim 8 , wherein a plurality of optical delivery beams are positioned between the heat spreader and the roof portion to provide optical access to the ion trap die.
12. The system of claim 8 , wherein the heat spreader base comprises a copper material to remove heat from the interposer and the ion trap.
13. The system of claim 8 , wherein the grid array comprises a ceramic material with an aperture that includes a plurality of connectors to electrically couple the interposer to the grid array.
14. The system of claim 8 , wherein the roof portion includes a top portion coupled to a bottom portion to secure a conductive mesh screen between the top portion and the bottom portion.
15. An enclosure for an ion trapping device, comprising:
a copper heat spreader base that includes a space between a center portion and a perimeter portion;
a ceramic pin grid array coupled to the copper heat spreader base, wherein a plurality of pins of the ceramic pin grid array are positioned between the perimeter portion and the center portion of the heat spreader base;
a spacer positioned within a depressed aperture of the ceramic pin grid array;
an interposer coupled to the spacer and aligned with plurality of studs of the spacer;
an ion trap die coupled to the interposer;
a first roof portion coupled to the copper heat spreader base to provide optical access to the ion trap die, wherein the first roof portion includes an aperture to expose a portion of the ion trap die; and
a second roof portion coupled to the first roof portion, wherein the second roof portion locks a conductive mesh over the aperture to prevent stray electric fields from entering the aperture of the first roof portion.
16. The device of claim 15 , wherein the ceramic pin grid array is detachable from the copper heat spreader base with a number of jack bolts.
17. The device of claim 15 , wherein the spacer comprises a tungsten material.
18. The device of claim 15 , wherein the ceramic pin grid array includes a plurality of contacts coupled to the ion trap via a plurality of connectors.
19. The device of claim 15 , wherein the copper heat spreader base includes a recessed portion for removing the copper heat spreader base from circuitry coupled to the ceramic pin grid array.
20. The device of claim 15 , wherein the spacer is coupled to the copper heat spreader base through the depressed aperture of the ceramic pin grid array.