Fine pitch copper pillar package and method
An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.
1. An electronic component assembly comprising:
an electronic component comprising a pad, the pad comprising a longitudinal pad length and a latitudinal pad width; and
a conductive pillar coupled to the pad, the conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width,
wherein:
the latitudinal pillar width is less than the longitudinal pillar length;
the latitudinal pad width is different from the latitudinal pillar width by a first amount;
the longitudinal pad length is different from the longitudinal pillar length by a second amount that is different from the first amount; and
an end surface of the conductive pillar is covered with reflowed solder while a majority of a lateral side of the conductive pillar is free of solder.
2. The electronic component assembly of claim 1 , wherein the lateral side of the conductive pillar is substantially free of solder.
3. The electronic component assembly of claim 1 , wherein the conductive pillar comprises a solder capped copper pillar.
4. The electronic component assembly of claim 1 , wherein the electronic component comprises a chip, and the pad comprises a bond-pad of the chip.
5. The electronic component assembly of claim 1 , wherein:
the electronic component comprises a chip that comprises a bond-pad and a metallization structure electrically coupled to the bond-pad; and
the pad comprises a terminal of the metallization structure laterally displaced from the bond-pad.
6. The electronic component assembly of claim 1 , wherein the conductive pillar is one of a plurality of conductive pillars arranged in a staggered configuration.
7. The electronic component assembly of claim 1 , wherein:
the electronic component comprises a second pad that is latitudinally adjacent to the pad; and
the latitudinal pad width is greater than a latitudinal distance between the pad and the second pad.
8. The electronic component assembly of claim 1 , wherein the conductive pillar is coupled to the pad through an under bump metallization.
9. The electronic component assembly of claim 1 , wherein:
the pad comprises a first longitudinal pad axis; and
the electronic component comprises a second pad comprising a second longitudinal pad axis that is angled at a diagonal relative to the first longitudinal pad axis.
10. An electronic component assembly comprising:
an electronic component comprising a pad, the pad comprising a first pad side facing away from the electronic component, the first pad side comprising an exposed area having a longitudinal pad length and a latitudinal pad width; and
a conductive pillar coupled to the pad, the conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width,
wherein:
the latitudinal pillar width is less than the longitudinal pillar length;
the latitudinal pad width is different from the latitudinal pillar width by a first amount;
the longitudinal pad length is different from the longitudinal pillar length by a second amount that is different from the first amount; and
an end surface of the conductive pillar is covered with reflowed solder while a majority of a lateral side of the conductive pillar is free of solder.
11. The electronic component assembly of claim 10 , wherein the lateral side of the conductive pillar is substantially free of solder.
12. The electronic component assembly of claim 10 , wherein the second amount is less than the first amount.
13. The electronic component assembly of claim 10 , wherein the conductive pillar comprises a solder capped copper pillar.
14. An electronic component assembly comprising:
an electronic component comprising:
a first conductor on a first side of the electronic component;
a non-conductive material surrounding the first conductor such that a first surface area of the first conductor is exposed from the non-conductive material, where the first surface area comprises a first longitudinal length and a first latitudinal width; and
a conductive pillar coupled to the first surface area, the conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width,
wherein:
the latitudinal pillar width is less than the longitudinal pillar length;
the first latitudinal width is different from the latitudinal pillar width by a first amount;
the first longitudinal length is different from the longitudinal pillar length by a second amount that is different from the first amount; and
an end surface of the conductive pillar is covered with reflowed solder while a majority of a lateral side of the conductive pillar is free of solder.
15. The electronic component assembly of claim 14 , wherein the conductive pillar is plated directly on the first surface area.
16. The electronic component assembly of claim 14 , wherein the conductive pillar is one of a plurality of conductive pillars arranged in a staggered configuration.
17. The electronic component assembly of claim 14 , wherein:
the electronic component comprises a second conductor that is latitudinally adjacent to the first conductor; and
the first latitudinal width is greater than a latitudinal distance between the first conductor and the second conductor.
18. The electronic component assembly of claim 14 , wherein no portion of the first conductor protrudes from the non-conductive material.
19. The electronic component assembly of claim 14 , wherein the first surface area of the first conductor corresponds to an entirety of a first side of the first conductor.
20. The electronic component assembly of claim 14 , comprising a dielectric material that contacts and laterally surrounds an entirety of the conductive pillar, and contacts the first surface area.