Photoresist contact patterning of quantum dot films
The present disclosure describes one or more embodiment of a method for creating a patterned quantum dot layer. The method includes bringing a patterning stamp in contact with a layer of quantum dots disposed on a substrate, the patterning stamp comprising a patterned photoresist layer disposed on an elastomer layer, such that a portion of the quantum dots in contact with the patterned photoresist layer adheres to the patterning stamp, the portion of the quantum dots being adhered quantum dots. The method also includes peeling the patterning stamp from the substrate with a peeling speed larger than a pre-determined peeling speed to remove the adhered quantum dots from the substrate. A remaining portion of the quantum dots forms a patterned quantum dot layer on the substrate.
1. A method for creating a patterned quantum dot layer, the method comprising:
bringing a patterning stamp in contact with a layer of quantum dots disposed on a substrate, the patterning stamp comprising a patterned photoresist layer disposed on an elastomer layer, such that a portion of the quantum dots in contact with the patterned photoresist layer adheres to the patterning stamp, the portion of the quantum dots being adhered quantum dots; and
peeling the patterning stamp from the substrate with a peeling speed larger than a pre-determined peeling speed to remove the adhered quantum dots from the substrate, wherein a remaining portion of the quantum dots forms a patterned quantum dot layer on the substrate.
2. The method according to claim 1 , the method further comprising:
spin-casting a solution of quantum dots on the substrate to form the layer of quantum dots.
3. The method according to claim 1 , wherein:
the elastomer layer comprises a polydimethysiloxane (PDMS) layer.
4. The method according to claim 1 , wherein:
the substrate comprises a silicon substrate coated with octadecyltrichlorosilane (ODTS).
5. The method according to claim 1 , wherein:
the pre-determined peeling speed is 1 cm per second.
6. The method according to claim 1 , further comprising:
prior to bringing the patterning stamp in contact with the quantum dots, photolithographically patterning a photoresist film on the elastomeric layer to form the patterned photoresist layer on the elastomer layer.
7. The method according to claim 1 , further comprising:
before bringing the patterning stamp in contact with the layer of quantum dots disposed on the substrate, heating the patterning stamp to about 65° C.; and
before peeling the patterning stamp from the substrate, cooling down the patterning stamp.
8. The method according to claim 1 , the method further comprising:
bringing a transferring stamp in contact with a transferring portion of the pattern quantum dot layer so as to adhere to the transferring portion, the transferring portion of the pattern quantum dot layer being transferring quantum dots;
moving the transferring stamp comprising the transferring quantum dots from the substrate to a desired location with respect to a receiving substrate;
contacting the transferring quantum dots with the receiving substrate; and
removing the transferring stamp from the receiving substrate, the transferring quantum dots being released such that the transferring quantum dots remain on the receiving substrate to form a second patterned quantum dot layer.
9. The method according to claim 8 , wherein:
the transferring stamp comprises at least one of an elastomer stamp or a shape memory polymer (SMP) stamp.
10. The method according to claim 9 , wherein:
the elastomer stamp comprises a PDMS stamp.