Apparatus and techniques for electronic device encapsulation
A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.
1. A method for providing a substrate coating, comprising:
providing a substrate to an ink jet printing system;
printing organic material in a deposition region of the substrate using the ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate;
providing the substrate with the organic material deposited thereon to a curing module;
supporting the substrate in the curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and
while supporting the substrate in the curing module, curing the organic material deposited on the substrate to form an organic film layer.
2. The method of claim 1 , further comprising, after providing the substrate to the ink jet printing system:
supporting the substrate in the ink jet printing system, the supporting the substrate in the ink jet printing system comprising floating the substrate on a first gas cushion established by a first floatation support apparatus,
wherein the gas cushion floating the substrate in the curing module is a second gas cushion, and the floatation support apparatus of the curing module is a second floatation support apparatus.
3. The method of claim 1 , wherein floating the substrate in the curing module while curing the organic material suppresses mura on the formed organic film layer.
4. The method of claim 1 , wherein the supporting the substrate in the curing module comprises forcing gas through a porous ceramic material.
5. The method of claim 1 , wherein the gas cushion is established using a non-reactive pressurized gas.
6. The method of claim 1 , wherein gas cushion is established using a combination of a pressurized non-reactive gas region and at least a partial vacuum region.
7. The method of claim 1 , wherein the supporting the substrate in the curing module further comprises physically contacting the substrate with a support structure.
8. The method of claim 7 , wherein physically contacting the substrate with the support structure is in an area corresponding to a region outside of the active region of the light-emitting device fabricated upon the substrate.
9. The method of claim 7 , wherein the support structure comprises at least one lift pin.
10. The method of claim 1 , further comprising while supporting the substrate in the curing module, restricting lateral movement of the substrate in at least one direction while supporting the substrate by the floatation support apparatus.
11. The method of claim 1 , wherein curing the organic material deposited on the substrate comprises curing the organic material using ultraviolet irradiation.
12. The method of claim 1 , further comprising holding the substrate in the curing module for a specified duration before curing the organic material deposited on the substrate.
13. The method of claim 1 , further comprising:
after printing the organic material in the deposition region of the substrate:
providing the substrate with the organic material deposited to a holding module;
holding the substrate for a specified duration in the holding module; and
transferring the substrate with the organic material thereon from the holding module to the curing module after holding the substrate for the specified duration.
14. The method of claim 1 , further comprising, after providing the substrate to the holding module:
supporting the substrate in the holding module, the supporting the substrate in the holding module comprising floating the substrate on a first gas cushion established by a first floatation support apparatus,
wherein the gas cushion floating the substrate in the curing module is a second gas cushion, and the floatation support apparatus of the curing module is a second floatation support apparatus.
15. The method of claim 1 , further comprising providing a controlled processing environment for each of the ink jet printing system and the curing module.
16. The method of claim 15 , wherein providing the controlled processing environment for each of the ink jet printing system and the curing module comprises maintaining one or more of a reactive species at or below a specified limit.
17. The method of claim 16 , wherein the one or more reactive species are chosen from at least one of water vapor, solvent vapor, ozone, and oxygen.
18. The method of claim 15 , wherein providing the controlled processing environment for each of the ink jet printing system and the curing module comprises maintaining a particulate level at or below a specified limit.
19. The method of claim 18 , further comprising filtering gas circulated along a path traversed by the substrate.
20. The method of claim 15 , wherein providing the controlled processing environment for each of the ink jet printing system and the curing module comprises providing a gas environment at or near atmospheric pressure.
21. The method of claim 20 , wherein providing the controlled processing environment for each of the ink jet printing system and the curing module comprises providing a non-reactive gas environment.
22. The method of claim 21 , wherein the non-reactive gas environment is maintained using nitrogen.