Robot for a liquid immersion cooling system
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
1. A device comprising: a tank configured to hold a thermally conductive, condensable dielectric fluid; a vapor management system for condensing a gas phase of the dielectric fluid wherein the vapor management system comprises a vapor storage unit which is operably connected to a carbon bed to separate the vapor of the dielectric fluid from air: and a robot configured to pick up a computer component; and wherein the vapor storage unit is a bellows tank.
2. The device of claim 1 , further comprising an airlock.
3. The device of claim 2 , wherein the airlock includes an inner door and an outer door.
4. The device of claim 3 , wherein the airlock is configured to receive an inert gas to purge the gas phase of the dielectric fluid before the outer door is opened.
5. The device of claim 3 , wherein the robot is located outside the tank.
6. The device of claim 3 , wherein the robot is located within the tank.
7. The device of claim 6 , wherein the robot is configured to remove the computer component from a rack and deliver the computer component to the airlock.
8. The device of claim 7 , wherein the robot is further configured to:
open the inner door of the airlock;
place the computer component in the airlock;
close the inner door of the airlock;
equalize a pressure of the airlock with an atmospheric pressure; and
open the outer door of the airlock.
9. The device of claim 8 , further comprising a second robot located outside of the tank.
10. The device of claim 9 , wherein the second robot is configured to remove the computer component from the airlock when the outer door is open.
11. The device of claim 9 , wherein the second robot is configured to place the computer component within a storage slot.
12. The device of claim 9 , wherein the airlock is configured to equalize the pressure of the airlock after the outer door is closed.
13. The device of claim 1 , wherein the device is configured to receive instructions from a server located outside of the device.
14. The device of claim 1 , wherein the computer component is located within a chassis showing an asset tag.
15. The device of claim 14 , wherein the robot is configured to scan the asset tag and relay the asset tag to a management system.
16. The device of claim 1 , wherein the robot is a gantry robot configured to remove, replace, or install the computer component.
17. The device of claim 16 , wherein the gantry robot is configured to move horizontally and vertically.
18. The device of claim 1 , wherein the robot is configured to remove, replace, or install a component of a power distribution system.
19. The device of claim 18 , wherein the component of the power distribution system is a transformer or a power supply.
20. The device of claim 1 , wherein the robot includes a gripping tool for gripping the computer component.
21. The device of claim 1 , wherein the vapor storage unit is configured to allow air into the vapor management system to cool the vapor of the dielectric fluid.