IP Library Granted Patent US 11,175,192
Granted Patent B2
US 11,175,192 · App. 16/577,094 · Granted Nov 16, 2021

Sensor assembly having an overload stop

Inventors: Ya-Mei Chen (Fremont, CA); James Hoffman (Santa Clara, CA)
Assignee: MEASUREMENT SPECIALTIES, INC.
G01L1/18B81B2201/0264
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Quick Facts
Patent No.
US 11,175,192
App. No.
16/577,094
Granted
Nov 16, 2021
Kind
B2
Abstract

A sensor assembly includes a sensor and an overload stop disposed on a surface of the sensor. The sensor has a resilient central region and an outer region surrounding the central region. The overload stop includes a center stop disposed on the central region and a peripheral stop disposed on the outer region.

Claims (28)

1. A sensor assembly, comprising:

a sensor having a resilient central region and an outer region surrounding the central region; and

an overload stop disposed on a surface of the sensor, the overload stop includes a center stop disposed on the central region and a peripheral stop disposed on the outer region.

2. The sensor assembly of claim 1 , wherein the center stop and the peripheral stop both protrude from the surface of the sensor.

3. The sensor assembly of claim 2 , wherein the center stop protrudes a first distance from the surface of the sensor and the peripheral stop protrudes a second distance from the surface of the sensor, the first distance is greater than the second distance.

4. The sensor assembly of claim 3 , wherein a difference between the first distance and the second distance is less than or equal to a maximum deflection of the central region.

5. The sensor assembly of claim 1 , wherein the center stop and the peripheral stop each have a rigidity greater than a rigidity of the central region.

6. The sensor assembly of claim 1 , wherein the center stop is fixed on the surface of the sensor at a position of maximum deflection of the central region.

7. The sensor assembly of claim 1 , wherein the sensor is a piezoresistive force sensor die.

8. A sensor package, comprising:

a sensor assembly including a sensor and an overload stop disposed on a surface of the sensor, the sensor has a resilient central region, the overload stop includes a center stop disposed on the central region; and

an actuation element movable between a first position and a second position, the actuation element urges the center stop during movement between the first position and the second position deflecting the central region in a deflection direction.

9. The sensor package of claim 8 , wherein the sensor has an outer region surrounding the central region and the overload stop further includes a peripheral stop disposed on the outer region.

10. The sensor package of claim 9 , wherein the center stop protrudes a first distance from the surface of the sensor and the peripheral stop protrudes a second distance from the surface of the sensor, the first distance is greater than the second distance.

11. The sensor package of claim 10 , wherein the second position of the actuation element corresponds to a maximum deflection of the central region, the actuation element contacts the center stop and the peripheral stop in the second position.

12. The sensor package of claim 8 , further comprising a housing containing the sensor assembly and an elastomer disposed between the sensor assembly and the housing.

13. The sensor package of claim 12 , wherein the elastomer has a conductive portion and a non-conductive portion.

14. The sensor package of claim 13 , wherein the conductive portion and the non-conductive portion of the elastomer are each formed of a biocompatible material.

15. The sensor package of claim 14 , wherein the non-conductive portion of the elastomer is formed of a polydimethylsiloxane and the conductive portion of the elastomer is formed of the polydimethylsiloxane with a conductive composite dispersed within the polydimethylsiloxane.

16. The sensor package of claim 13 , wherein the conductive portion of the elastomer electrically connects an electrical pad of the sensor with an electrical contact disposed on the housing.

17. The sensor package of claim 12 , wherein the elastomer is disposed between the surface of the sensor and the housing and between a side of the sensor and the housing.

18. The sensor package of claim 17 , wherein the elastomer is disposed between a bottom of the sensor and the housing.

19. The sensor package of claim 12 , further comprising an integrated circuit disposed within the housing and electrically connected to the sensor.

20. A method of forming a sensor assembly, comprising:

providing a sensor having a central region adapted to resiliently deflect and an outer region surrounding the central region; and

depositing an overload stop on a surface of the sensor, the overload stop includes a center stop disposed on the central region and a peripheral stop disposed on the outer region.

21. The method of claim 20 , wherein the depositing step forms each of the center stop and the peripheral stop as a plurality of film layers on the surface of the sensor.

22. The method of claim 21 , wherein the center stop protrudes a first distance from the surface of the sensor and the peripheral stop protrudes a second distance from the surface of the sensor, the first distance is greater than the second distance.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2023
From: MEASUREMENT SPECIALTIES, INC.
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 063787/0258 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2019
From: CHEN, YA-MEI; HOFFMAN, JAMES
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 050442/0587 →
Continuity (1)
Related Publication 20210088391A1 · Mar 25, 2021
Cited By (1)
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