Apparatus and method for thermal dissipation of photonic transceiving module

1. An apparatus for dissipating heat from a photonic transceiver module comprising:

a top-plate member disposed in a length direction of a package for the photonic transceiver module;

multiple fins with one length formed on the top-plate member along the length direction of the package for the photonic transceiver module from a backend position of the multiple fins near a middle of the top-plate member to a frontend position except that an elongated void is formed from the backend position of the multiple fins to one backend of at least one fin of the multiple fins with a shorter length;

a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of a backend of the horizontal sheet; and

a spring loaded in the elongated void between the flange and the one backend of the at least one fin of the multiple fins for naturally pushing the cover member to slide backward beyond the backend position of the multiple fins until the backend of the horizontal sheet is stopped against an object.

2. The apparatus of claim 1 wherein the multiple fins, the cover member and the spring defines an external heat sink that is coupled to a face plate of an internal thermal dissipation equipment for the photonic transceiver module.

3. The apparatus of claim 2 wherein the multiple fins are configured vertically on the top-plate member with a same height and a gap between any two neighboring fins throughout the one length of the multiple fins with the backend position of the multiple fins being separated by a marginal gap distance of about 1 to 2 millimeters from the face plate of the internal thermal dissipation equipment as the photonic transceiver module is fully plugged in.

4. The apparatus of claim 3 wherein the multiple fins comprise two out-most fins, each of them having two notches formed at an outer face thereof.

5. The apparatus of claim 4 wherein each of the two vertical side sheets of the cover member comprises two slots respectively for fitting the two notches so that the cover member is partially locked with the multiple fins, each of the two slots having an extra free spacing at least larger than the marginal gap in the length direction of the package for the photonic transceiver module.

6. The apparatus of claim 5 wherein the extra free spacing is configured to be at least larger than the marginal gap distance for the cover member to move laterally along the length direction of the package for the photonic transceiver module as the spring pushes the backend of the horizontal sheet against the face plate of the internal thermal dissipation equipment.

7. The apparatus of claim 5 wherein the horizontal sheet of the cover member is disposed to touch top ridges of the multiple fins to form multiple air flow channels in the gaps between two neighboring ones of the multiple fins for pulling heat of the package for the photonic transceiver module into the internal thermal dissipation equipment to minimize an air gap between the backend of the horizontal sheet and the face plate of the internal thermal dissipation equipment.

8. The apparatus of claim 1 wherein the package for the photonic transceiver module comprises an optical network module in Quad Small Form-Factor Pluggable (QSFP) specification.

9. The apparatus of claim 1 wherein the package for the photonic transceiver module comprises an optical network module in Quad Small Form-Factor Pluggable Double Density (QSFP-DD) specification.

10. The apparatus of claim 1 wherein the package for the photonic transceiver module comprises an optical network module in Quad Small Form-Factor Pluggable Double Density Type II (QSFP-DD type 2) specification.

11. A package structure for a photonic transceiver module comprising the apparatus of claim 1 for dissipating heat up to 20 W therefrom.

12. The package structure of claim 11 wherein the photonic transceiver module is configured to be in Quad Small Form-Factor Pluggable Double Density Type II (QSFP-DD type 2) specification.

13. A method of dissipating heat from a package of a photonic transceiver module comprising:

setting a top-plate member disposed in a length direction of the package;

forming multiple fins of one length on the top-plate member along the length direction of the package from a backend position of the multiple fins near a middle of the top-plate member to a frontend position except an elongated void being formed from the backend position of the multiple fins to one backend of at least one fin of the multiple fins with a shorter length;

disposing a cover member over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of a backend of the horizontal sheet; and

loading a spring in the elongated void between the flange and the one backend of the at least one fin of the multiple fins for naturally pushing the cover member backward beyond the backend position of the multiple fins until the backend of the horizontal sheet is stopped against an object.

14. The method of claim 13 wherein providing multiple fins, cover member and the spring forms an external heat sink that is coupled to a face plate of an internal thermal dissipation equipment for the photonic transceiver module.

15. The method of claim 14 wherein forming the multiple fins comprises configuring each fin vertically with a height on the top-plate member and laterally with a gap between any two neighboring fins throughout the one length of the multiple fins with the backend position of the multiple fins being separated by a nominal gap of about 1 to 2 millimeters from the face plate of the internal thermal dissipation equipment as the photonic transceiver module is fully plugged in.

16. The method of claim 15 wherein forming the multiple fins comprises forming two notches at each outer surface of two fins located at two out-most locations.

17. The method of claim 16 wherein disposing the cover member comprises having two slots formed at the two vertical side sheets to fit with the two notches for partially locking the cover member with the multiple fins, yet each of the two slots having an extra free spacing at least larger than the nominal gap in the length direction of the package.

18. The method of claim 17 wherein the extra free spacing is configured to be at least larger than the nominal gap distance for the cover member to be move laterally along the length direction of the package as the spring pushes the backend of the horizontal sheet against the face plate of the internal thermal dissipation equipment.

19. The method of claim 15 wherein disposing the cover member further comprises forming multiple air flow channels for pulling heat of the package through the multiple fins into the internal thermal dissipation equipment to minimize an air gap between the backend of the horizontal sheet and the face plate of the internal thermal dissipation equipment.

20. The method of claim 19 wherein forming the multiple air flow channels to minimize the air gap between the backend of the horizontal sheet and the face plate of the internal thermal dissipation equipment further comprises providing thermal dissipation up to 20 W in heat power.