IP Library Granted Patent US 11,276,807
Granted Patent B2
US 11,276,807 · App. 16/581,627 · Granted Mar 15, 2022

Light-emitting device manufacturing method including filling conductive material in groove structure formed by irradiating with laser light

Inventors: Rie Maeda (Katsuura-gun, JP); Masaaki Katsumata (Anan, JP)
Assignee: NICHIA CORPORATION
H01L33/62H01L25/0753H01L33/36H01L33/56G02F1/133603H01L2933/0016H01L2933/0066
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Quick Facts
Patent No.
US 11,276,807
App. No.
16/581,627
Granted
Mar 15, 2022
Kind
B2
Abstract

A light-emitting device manufacturing method including providing a light-emitting structure including one or more light-emitting elements and a covering member covering the light-emitting elements. Each of the light-emitting elements have first and second electrodes. The light-emitting structure has a first surface and a second surface opposite to the first surface, and lower surfaces of the first and second electrodes of each light-emitting element are closer to the first surface than the second surface. The method further includes forming a groove structure on the first surface side by irradiation with laser light such that at least part of the first and second electrodes are exposed to an inside of the groove structure, and forming a plurality of wirings inside of the groove structure.

Claims (12)

1. A light-emitting device manufacturing method comprising:

providing at least one light-emitting structure, the at least one light-emitting structure having a first surface and a second surface opposite to the first surface, the at least one light-emitting structure including one or more light-emitting elements and a covering member covering the one or more light-emitting elements, each of the one or more light-emitting elements having a first electrode and a second electrode each having a lower surface, the lower surface of the first electrode and the lower surface of the second electrode each being closer to the first surface than the second surface;

removing part of the covering member, part of the first electrode and part of the second electrode by irradiation with laser light from a first surface side to form a groove structure on the first surface side of the at least one light-emitting structure such that at least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure; and

filling the inside of the groove structure with an electrically-conductive material to form a plurality of wirings.

2. The method of claim 1 , wherein

the one or more light-emitting elements include a first light-emitting element and a second light-emitting element, and

the forming of the plurality of wirings includes electrically connecting the first light-emitting element and the second light-emitting element in series or in parallel by the plurality of wirings.

3. The method of claim 1 , wherein

the providing of the at least one light-emitting structure includes providing a first light-emitting structure and a second light-emitting structure, and

the forming of the plurality of wirings includes electrically connecting a first light-emitting element of a first light-emitting structure side and a second light-emitting element of a second light-emitting structure side in series or in parallel by the plurality of wirings.

4. The method of claim 3 further comprising, between the providing of the at least one light-emitting structure and the forming of the groove structure or between the forming of the groove structure and the forming of the plurality of wirings, one-dimensionally or two-dimensionally arraying a plurality of the first and second light-emitting structures.

5. The method of claim 1 wherein, in the providing of the at least one light-emitting structure, the lower surface of the first electrode and the lower surface of the second electrode are exposed out of the covering member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2019
From: MAEDA, RIE; KATSUMATA, MASAAKI
To: NICHIA CORPORATION
Reel/Frame 050479/0033 →
Priority Claims (1)
JP JP2018-179258 · Sep 25, 2018 · national
Continuity (1)
Related Publication 20200098963A1 · Mar 26, 2020
Cited By (1)
US 12,588,325