Semiconductor device and amplifier
A semiconductor device includes an electric circuit configured to include, a transistor, a first pad coupled to a gate or a drain of the transistor, a second pad coupled to the gate or the drain of the transistor, a first wiring that extends from the gate or the drain of the transistor to the first pad, and a second wiring that diverges from the first wiring and extends to the second pad, and a redistribution layer formed over the electric circuit and configured to include a first redistribution coupled to the first pad, and a second redistribution coupled to the second pad to constitute a stub.
1. A semiconductor device comprising:
an electric circuit configured to include:
a transistor,
a first pad coupled to a gate or a drain of the transistor,
a second pad coupled to the gate or the drain of the transistor,
a first wiring that extends horizontally from the gate or the drain of the transistor to the first pad, and
a second wiring that directly connects with and diverges from the first wiring and extends horizontally to the second pad; and
a redistribution layer formed over the electric circuit and configured to include:
a first redistribution coupled to the first pad, and
a second redistribution coupled to the second pad to constitute an open stub or a short stub.
2. The semiconductor device according to claim 1 ,
wherein the electric circuit includes a third pad, and
wherein the redistribution layer includes:
a first via that couples the second pad to one end side of the second redistribution, and
a second via that couples the third pad to an other end side of the second redistribution.
3. The semiconductor device according to claim 2 ,
wherein the electric circuit includes:
one or more third wirings that extends from the third pad, and
one or more capacitors coupled to the third pad via the one or more third wirings.
4. The semiconductor device according to claim 3 ,
wherein the one or more third wirings extends from the third pad in a direction different from a first direction in which the second wiring extends from the second pad.
5. The semiconductor device according to claim 3 ,
wherein the one or more third wirings corresponds to three third wirings that extend from the third pad,
wherein the three third wirings extend from the third pad in a second direction opposite to the first direction and in a third direction and a fourth direction that intersect the first direction, and
wherein the one or more capacitors are coupled to the third pad via the three third wirings.
6. The semiconductor device according to claim 5 ,
wherein the one or more capacitors corresponds to one capacitor that surrounds the third pad in a U-shape.
7. The semiconductor device according to claim 1 ,
wherein a bias voltage is supplied to the transistor via the second redistribution.
8. The semiconductor device according to claim 1 ,
wherein the electric circuit includes a capacitor coupled between the first pad and a branch point at which the second wiring diverges from the first wiring.
9. The semiconductor device according to claim 1 ,
wherein the first redistribution and the second redistribution constitute a matching circuit that performs an impedance matching of high frequency signals amplified by the transistor.
10. The semiconductor device according to claim 1 ,
wherein the electric circuit includes a substrate made of gallium nitride.
11. The semiconductor device according to claim 1 ,
wherein the transistor amplifies a high frequency signal.
12. An amplifier comprising:
a substrate configured to include:
an electric circuit configured to include:
a transistor configured to amplify a high frequency signal,
a first pad coupled to a gate or a drain of the transistor,
a second pad coupled to the gate or the drain of the transistor,
a first wiring that extends horizontally from the gate or the drain of the transistor to the first pad, and
a second wiring that directly connects with and diverges from the first wiring and extends horizontally to the second pad, and
a redistribution layer formed over the electric circuit and configured to include:
a first redistribution coupled to the first pad, and
a second redistribution coupled to the second pad to constitute an open stub or a short stub.