Bipolar transistor

1. A method of manufacturing a bipolar transistor, comprising:

forming a first portion of a collector with a well region that is buried within a semiconductor substrate below a portion of the semiconductor substrate;

forming an insulating trench over the well region and extending through the portion of the semiconductor substrate to the well region; and

forming a second portion of the collector from semiconductor material which crosses through an insulating material filling the insulating trench, wherein a bottom of the second portion of the collector is in physical contact with a top of the first portion of the collector;

wherein forming the second portion of the collector comprises:

forming a cavity by etching that extends to cross through the insulating material filling the insulating trench to reach the well region; and

filling the cavity with the semiconductor material for the second portion of the collector.

2. The method of claim 1 , wherein the forming of the first portion of the collector is performed before the etching of the cavity.

3. The method of claim 1 , wherein forming the first portion of the collector comprises implantation of dopants in the semiconductor substrate at a depth below the portion of the semiconductor substrate to form the well region.

4. A method of manufacturing a bipolar transistor, comprising:

forming a first portion of a collector with a well region that is buried within a semiconductor substrate below a portion of the semiconductor substrate;

forming an insulating trench over the well region and extending through the portion of the semiconductor substrate to the well region; and

forming a second portion of the collector from semiconductor material which crosses through an insulating material filling the insulating trench, wherein a bottom of the second portion of the collector is in physical contact with a top of the first portion of the collector;

wherein forming of the second portion of the collector comprises:

forming a conduction element over the insulating trench;

etching the conduction element; and

forming an air pocket between the second portion of the collector and the conduction element.

5. A bipolar transistor, comprising:

a semiconductor substrate;

a well region that is buried within a semiconductor substrate below a portion of the semiconductor substrate to form a first portion of a collector for the bipolar transistor;

an insulating trench over the well region and extending through the portion of the semiconductor substrate to the well region;

a semiconductor material which crosses through an insulating material filling the insulating trench forming a second portion of the collector for the bipolar transistor, wherein a bottom of the second portion of the collector is in physical contact with a top of the first portion of the collector; and

a conduction element over the insulating trench, wherein the conduction element includes an opening forming an air pocket between the second portion of the collector and the conduction element.

6. The bipolar transistor of claim 5 , wherein said semiconductor material forming the second portion of the collector closes off the air pocket.

7. A method of manufacturing a bipolar transistor, comprising:

forming a first portion of a collector with a well region that is buried within a semiconductor substrate below a portion of the semiconductor substrate;

forming an insulating trench over the well region and extending through the portion of the semiconductor substrate to the well region; and

forming a second portion of the collector from semiconductor material which crosses through an insulating material filling the insulating trench, wherein a bottom of the second portion of the collector is in physical contact with a top of the first portion of the collector;

wherein forming the first portion of the collector is performed after forming the insulating trench.

8. The method of claim 7 , wherein forming the first portion of the collector comprises implanting dopants in the semiconductor substrate to form the well region.

9. A method of manufacturing a bipolar transistor, comprising:

forming a first portion of a collector with a well region that is buried within a semiconductor substrate below a portion of the semiconductor substrate;

forming an insulating trench over the well region and extending through the portion of the semiconductor substrate to the well region; and

forming a second portion of the collector from semiconductor material which crosses through an insulating material filling the insulating trench, wherein a bottom of the second portion of the collector is in physical contact with a top of the first portion of the collector;

wherein forming of the second portion of the collector comprises:

forming a cavity extending completely through a thickness of the insulating material filling the insulating trench to reach an upper surface of the well; and

epitaxially growing semiconductor material in said cavity to produce the second portion of the collector surrounded by the insulating material.

10. The method of claim 9 , further comprising:

forming a layer over the insulating trench;

wherein forming the cavity extends completely through said layer;

laterally etching a portion of the layer to form an opening surrounding said cavity;

wherein epitaxially growing semiconductor material in said cavity closes off said opening to form an air pocket around the second portion of the collector.

11. The method of claim 10 , wherein said layer is made of a conductive material and wherein said air pocket insulates the conductive material from said second portion of the collector.

12. A bipolar transistor, comprising:

a semiconductor substrate;

a well region located within a semiconductor substrate forming a first portion of a collector for the bipolar transistor;

an insulating trench over the well region;

a semiconductor material which crosses through an insulating material filling the insulating trench forming a second portion of the collector for the bipolar transistor;

wherein a bottom of the second portion of the collector is in physical contact with a top of the first portion of the collector;

a conduction element over the insulating trench, wherein the conduction element includes an opening forming an air pocket between the second portion of the collector and the conduction element; and

wherein said semiconductor material forming the second portion of the collector closes off the air pocket.

13. A method of manufacturing a bipolar transistor, comprising:

forming a first portion of a collector with a well region located within a semiconductor substrate;

forming an insulating trench over the well region;

forming a layer over the insulating trench;

forming a cavity extending completely through said layer and a thickness of an insulating material filling the insulating trench to reach an upper surface of the well;

laterally etching a portion of the layer to form an opening surrounding said cavity; and

forming a second portion of the collector from semiconductor material which crosses through an insulating material filling the insulating trench, wherein a bottom of the second portion of the collector is in physical contact with a top of the first portion of the collector, and wherein forming of the second portion of the collector comprises epitaxially growing semiconductor material in said cavity to produce the second portion of the collector surrounded by the insulating material;

wherein epitaxially growing semiconductor material in said cavity closes off said opening to form an air pocket around the second portion of the collector.

14. The method of claim 13 , wherein forming the first portion of the collector comprises implantation of dopants in the semiconductor substrate to form the well region.

15. The method of claim 13 , wherein forming the first portion of the collector is performed after forming the insulating trench.

16. The method of claim 15 , wherein forming the first portion of the collector comprises implanting dopants in the semiconductor substrate to form the well region.

17. The method of claim 13 , wherein said layer is made of a conductive material and wherein said air pocket insulates the conductive material from said second portion of the collector.