Light emitting diodes manufacture and assembly

1. A method, comprising:

forming an epitaxial layer on a starter substrate;

attaching the epitaxial layer onto a carrier substrate;

etching away the starter substrate;

etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies;

establishing one or more conductive bonds between one or more LED dies of the plurality of LED dies and a backplane;

using a light directed through the carrier substrate to weaken a bond between the epitaxial layer and the carrier substrate; and

moving the carrier substrate away from the backplane to transfer the one or more LED dies to the backplane.

2. The method of claim 1 ,

wherein the epitaxial layer has a first surface that interfaces with the starter substrate and a second surface opposite to the first surface;

wherein the epitaxial layer further includes a quantum well layer to generate light; and

wherein the quantum well layer is positioned closer to the first surface than to the second surface.

3. The method of claim 1 , wherein the starter substrate is opaque.

4. The method of claim 3 , wherein the starter substrate includes Gallium Arsenide material.

5. The method of claim 1 , wherein the carrier substrate includes glass.

6. The method of claim 5 , further comprising forming an adhesive layer between the epitaxial layer and the carrier substrate,

wherein the epitaxial layer comprises at least one of: a polymer, a glue, or wax.

7. The method of claim 6 , wherein the light is laser light; and

wherein the laser light is directed through the carrier substrate to melt the adhesive layer to weaken at least a portion of the adhesive layer.

8. The method of claim 1 , further comprising:

forming device-side bumps on the plurality of LED dies;

forming backplane-side bumps on at least one of one or more pre-determined locations on the backplane, the at least one of one or more pre-determined locations corresponding to the selected one or more LED dies; and

establishing the one or more conductive bonds between the device-side bumps on the selected one or more LED dies and the backplane-side bumps on the backplane.

9. The method of claim 8 , further comprising:

heating the device-side bumps and the backplane-side bumps to a pre-determined temperature to form the one or more conductive bonds between the device-side bumps on the selected one or more LED dies and the backplane-side bumps on the backplane.

10. The method of claim 1 , wherein the backplane is a first backplane;

wherein the one or more LED dies are first selected one or more LED dies;

wherein the one or more conductive bonds are first one or more conductive bonds;

and wherein the method further comprises:

moving, using a pick up tool (PUT), the carrier substrate towards the first backplane to establish the first one or more conductive bonds between the first selected one or more LED dies and the first backplane;

moving, using the PUT, the carrier substrate away from the first backplane to transfer the first selected one or more LED dies to the first backplane;

moving, using the PUT, the carrier substrate towards a second backplane to establish second one or more conductive bonds between second selected one or more LED dies and the second backplane; and

moving, using the PUT, the carrier substrate away from second backplane to transfer the second selected one or more LED dies to the second backplane.

11. The method of claim 1 , further comprising:

applying a signal to each of the plurality of LED dies to control each of the plurality of LED dies to emit light;

collecting, using a light sensor array and via the carrier substrate, light emitted by one or more LEDs of the plurality of LED dies in response to the signal; and

selecting, based on an output of the light sensor array and from the plurality of LED dies, the one or more LED dies to establish the one or more conductive bonds with the backplane.

12. The method of claim 1 , wherein the backplane comprises a thin film transistor (TFT) backplane.

13. The method of claim 1 , wherein the the plurality of LED dies are formed on a surface of the epitaxial layer that interfaces with the starter substrate.

14. A method, comprising:

forming an epitaxial layer on a starter substrate attaching the epitaxial layer onto a first carrier substrate;

etching away the starter substrate;

attaching the epitaxial layer onto a second carrier substrate;

moving the first carrier substrate away from the epitaxial layer;

etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies on the epitaxial layer;

establishing one or more conductive bonds between one or more LED dies of the plurality of LED dies and a backplane;

using a light directed through the second carrier substrate to weaken a bond between the epitaxial layer and the second carrier substrate; and

moving the second carrier substrate away from the backplane to transfer the one or more LED dies to the backplane.

15. The method of claim 14 ,

wherein the epitaxial layer has a first surface that interfaces with the starter substrate and a second surface opposite to the first surface;

wherein the epitaxial layer further includes a quantum well layer to generate light; and

wherein the quantum well layer is positioned closer to the second surface than to the first surface.

16. The method of claim 14 , wherein the starter substrate includes Gallium Arsenide material.

17. The method of claim 14 , wherein the first carrier substrate and the second carrier substrate include glass; and

wherein the method further comprises:

using a light directed through the first carrier substrate to weaken a first adhesive bond between the epitaxial layer and the first carrier substrate; and

wherein the bond between the epitaxial layer and the second carrier substrate comprises a second adhesive bond.

18. The method of claim 17 , further comprising forming a first adhesive layer between the epitaxial layer and the first carrier substrate, the first adhesive layer comprising at least one of: a polymer, a glue, or wax; and

forming a second adhesive layer between the epitaxial layer and the second carrier substrate, the second adhesive layer comprising at least one of: a polymer, a glue, or wax.

19. The method of claim 18 , wherein the light is laser light; and

wherein the laser light is directed through the first carrier substrate to melt the first adhesive layer to weaken the first adhesive bond; and

wherein the laser light is directed through the second carrier substrate to melt the second adhesive layer to weaken the second adhesive bond.

20. The method of claim 14 , wherein the plurality of LED dies are formed on a surface of the epitaxial layer that previously interfaced with the starter substrate.