Manufacture of semiconductor display device

1. A method, comprising:

forming a plurality of light emitting diode (LED) dies on a single starter substrate;

moving, using a pick up tool (PUT), the single starter substrate and the plurality of LED dies on the single starter substrate towards a backplane;

establishing electrical conductive bonds between the plurality of LED dies and the backplane; and

releasing the PUT from the single starter substrate to enable transferring of the plurality of LED dies to the backplane.

2. The method of claim 1 , wherein the plurality of LED dies forms a first strip having a first width along a first axis and a first length along a second axis;

wherein the single starter substrate has a second width along the first axis;

wherein the first width is of several orders of magnitude below the first length; and

wherein the second width is of several orders of magnitude above the first width.

3. The method of claim 1 , wherein the PUT comprises a holding device having a dimension that is of several orders of magnitude above a dimension of each of the plurality of LED dies.

4. The method of claim 3 , wherein the PUT comprises at least one of: a vacuum PUT or a stamp PUT.

5. The method of claim 4 , further comprising:

adhering a stamp of the stamp PUT to the starter substrate using an adhesive material; and

moving the stamp to bring the starter substrate towards the backplane.

6. The method of claim 5 , wherein the stamp of the stamp PUT is adhered to the starter substrate at an adhesion location of the starter substrate, the adhesion location being determined to enable the starter substrate to block the adhesive material from reaching a surface of the backplane to which the plurality of LED dies are conductively bonded.

7. The method of claim 3 , further comprising:

operating the PUT to control an orientation of the starter substrate to control orientations of the plurality of LED dies when device-side bumps of the plurality of LED dies are brought into contact with backplane-side bumps of the backplane.

8. The method of claim 1 , wherein: the plurality of LED dies forms a first LED strip, and the single starter substrate is a first single starter substrate; and

wherein the method further comprises:

forming a second LED strip on a second single starter substrate;

moving, using the PUT, the second single starter substrate and the second LED strip on the second single starter substrate towards the backplane; and

establishing electrical conductive bonds between the second LED strip and the backplane.

9. The method of claim 8 , further comprising:

forming a third LED strip on a third single starter substrate;

moving, using the PUT, the third single starter substrate and the third LED strip on the third single starter substrate towards the backplane; and

establishing conductive bonds between the third LED strip and the backplane.

10. The method of claim 9 , wherein:

the first LED strip is assembled as a red LED strip on the backplane,

the second LED strip is assembled as a blue LED strip on the backplane,

the third LED strip is assembled as a green LED strip on the backplane, and

the red LED strip, the blue LED strip, and the green LED strip form a group of three parallel LED strips on the backplane.

11. The method of claim 9 , wherein the second single starter substrate and the third single starter substrate are moved together towards the backplane by the PUT to bring the second LED strip and the third LED strip towards the backplane simultaneously.

12. The method of claim 9 , wherein the second single starter substrate and the third single starter substrate are moved towards the backplane at different times.

13. The method of claim 8 , wherein the first single starter substrate comprises a gallium arsenide material;

wherein the second single starter substrate comprises a sapphire material;

wherein the first LED strip includes LED devices having a light emitting layer to emit red light; and

wherein the second LED strip includes LED dies having a light emitting layer to emit green light or blue light.

14. The method of claim 8 , wherein the first single starter substrate is removed by etching after the electrical conductive bonds between the first LED strip and the backplane are established.

15. The method of claim 8 , further comprising:

removing the second single starter substrate from the second LED strip after the electrical conductive bonds between the second LED strip and the backplane are established.

16. The method of claim 15 , wherein removing the second single starter substrate from the second LED strip comprises:

projecting laser light via the single second starter substrate to weaken bonding between the second single starter substrate and the second LED strip; and

moving the second single starter substrate away from the second LED strip to break the weakened bonding.

17. The method of claim 8 , wherein the second LED strip is brought towards the backplane after the electrical conductive bonds are established between the first LED strip and the backplane.

18. The method of claim 17 , wherein the second LED strip is formed closer to a longitudinal edge of the second single starter substrate than to a longitudinal center line of the second single starter substrate.

19. The method of claim 8 , wherein the first LED strip is brought towards the backplane after the electrical conductive bonds are established between the second LED strip and the backplane.

20. The method of claim 19 , wherein the second LED strip is formed along a longitudinal center line of the second starter substrate.

21. The method of claim 8 , wherein the first single starter substrate is removed from the first LED strip prior to establishing electrical conductive bonds between the second LED strip and the backplane.

22. The method of claim 1 , wherein each of the plurality of LED dies including a device-side bump;

wherein the backplane includes a plurality of backplane-side bumps at a plurality of contact locations corresponding to the plurality of LED dies; and

wherein the electrical conductive bonds are formed between the device-side bumps of the plurality of LED dies and the backplane-side bumps of the backplane at the plurality of contact locations.

23. The method of claim 1 , wherein the PUT is operated to release the single starter substrate after the electrical conductive bonds between the plurality of LED dies and the backplane are established.