Molded circuit substrates
Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
1. An optoelectronic module comprising:
a conductive layer;
electrically insulating sidewalls laterally surrounding the conductive layer, and an internal electrically insulating wall extending through the conductive layer, wherein the electrically internal insulating wall separates first and second optical channels of the optoelectronic module from one another;
a first electrically insulating partition extending through the conductive layer, wherein the first electrically insulating partition separates a first part of the conductive layer into first and second regions electrically isolated from one another;
a second electrically insulating partition extending through the conductive layer, wherein the second electrically insulating partition separates a second part of the conductive layer into third and fourth regions electrically isolated from one another;
a light emitter in the first optical channel, the light emitter being mounted on the first region of the conductive layer, the light emitter being connected electrically to the second region of the conductive layer; and
a light detector in the second optical channel, the light detector being mounted on the third region of the conductive layer, the light detector being connected electrically to the fourth region of the conductive layer;
wherein the internal electrically insulating wall is non-transparent to a wavelength of light that the light emitted is operable to emit and that the light detector is operable to sense.
2. The optoelectronic module of claim 1 , wherein the conductive layer includes a metal.
3. The optoelectronic module of claim 1 , wherein the first and second insulating partitions include an epoxy resin.
4. The optoelectronic module of claim 1 , wherein the first and second insulating partitions include an epoxy resin containing a filler.
5. The optoelectronic module of claim 1 , wherein the first and second insulating partitions include an epoxy resin containing a carbon black filler.
6. The optoelectronic module of claim 1 , wherein each of the electrically insulating sidewalls laterally and the internal electrically insulating wall includes an epoxy resin.
7. The optoelectronic module of claim 1 , wherein each of the electrically insulating sidewalls laterally and the internal electrically insulating wall includes an epoxy resin containing a filler.
8. The optoelectronic module of claim 1 , wherein each of the electrically insulating sidewalls laterally and the internal electrically insulating wall includes an epoxy resin containing a carbon black filler.
9. The optoelectronic module of claim 1 , wherein the conductive layer has a thickness of less than approximately μm.
10. The optoelectronic module of claim 1 , wherein the electrically insulating sidewalls laterally, the internal electrically insulating wall, and first and second insulating partitions are composed of a cured moldable material.