Integrated high-power tunable laser with adjustable outputs
A tunable laser that includes an array of parallel optical amplifiers is described. The laser may also include an intracavity N×M coupler that couples power between a cavity mirror and the array of parallel optical amplifiers. Phase adjusters in optical paths between the N×M coupler and the optical amplifiers can be used to adjust an amount of power output from M−1 ports of the N×M coupler. A tunable wavelength filter is incorporated in the laser cavity to select a lasing wavelength.
1. An optical system comprising:
a semiconductor optical amplifier (SOA); wherein the SOA is formed on a first semiconductor chip; wherein the first semiconductor chip is flip-chip bonded to a first sub-mount; wherein the first sub-mount is mounted to a base mount; wherein the first semiconductor chip comprises a first set of optical paths; wherein the SOA is coupled to at least a path of the set of optical paths; and
a second semiconductor chip mounted right side up on the base mount; wherein the second semiconductor chip is a photo-integrated circuit (PIC) facing upward; where the first semiconductor chip is coupled to the second semiconductor chip; wherein the second semiconductor chip comprises a second set of optical paths; wherein at least one optical path of the first set of optical paths is connected to at least one optical path of the second set of optical paths.
2. The optical system of claim 1 wherein the second semiconductor chip has a tunable wavelength filter.
3. The optical system of claim 1 wherein the SOA is formed on a process side of the first semiconductor chip.
4. The optical system of claim 1 wherein the first sub-mount comprises aluminum nitride and has a higher thermal conductivity of a material of the first semiconductor chip and enables improved heat dissipation.
5. The optical system of claim 4 wherein the material of the first semiconductor chip is indium phosphide.
6. The optical system of claim 1 wherein the second semiconductor chip is aligned and bonded to the base mount.
7. The optical system of claim 6 wherein an adhesive affixes the second semiconductor chip to preserve alignment of the first semiconductor chip and the second semiconductor chip.
8. The optical system of claim 1 wherein the second semiconductor chip comprises a trench to receive the first semiconductor chip.