Lighting assembly with improved thermal behaviour

1. A lighting assembly comprising:

at least one point-like light source having a first and a second electrical contact;

a lead frame comprising a plurality of metal areas; and

a plastic layer at least on top of the lead frame, the plastic layer comprising vias above the metal areas that are each completely filled with electrical conductive material, the plurality of metal areas of the lead frame being exposed from the plastic layer such that a bottom surface of the plastic layer and a bottom surface of the metal areas forms a bottom-most surface of the lighting assembly,

the at least one point-like light source being disposed in direct contact with a first surface of the plastic layer facing away from the lead frame, in direct contact with the electrical conductive material in the vias, and in electrical contact and thermal contact with the plurality of metal areas of the lead frame through the vias; and

one or more conductive traces on the first surface of the plastic layer facing away from the lead frame and electrically insulated from the metal areas of the lead frame.

2. The lighting assembly in accordance with claim 1 , wherein:

the at least one point-like light source is directed connected on top of the lead frame, and

a material, a shape and a size of the vias is adapted in order not to decrease the heat spread compared to the heat spread for the at least one point-like light source directly connected on top of the lead frame.

3. The lighting assembly in accordance with claim 1 , wherein the plastic layer is an overmolded plastic material.

4. The lighting assembly in accordance with claim 1 , wherein the one or more conductive traces on the first surface of the plastic layer are provided by using molded interconnect device (MID) technology.

5. The lighting assembly in accordance with claim 1 , wherein the at least one point-like light source comprises two point-like light sources, each electrically coupled to one of the vias.

6. The lighting assembly in accordance with claim 1 , wherein the at least one point-like light source comprises one or more light-emitting diode (LED) devices.

7. A lighting device comprising:

one or more lighting assemblies, each of the one or more lighting assemblies comprising:

a lead frame comprising a plurality of metal areas, and

a plastic layer at least on top of the lead frame, the plastic layer comprising vias above the metal areas that are each completely filled with electrical conductive material, the plurality of metal areas of the lead frame being exposed from the plastic layer such that a bottom surface of the plastic layer and a bottom surface of the metal areas form a bottom-most surface of the lighting assembly,

the at least one point-like light source being disposed in direct contact with a first surface of the plastic layer facing away from the lead frame, in direct contact with the electrical conductive material in the vias, and in electrical contact and thermal contact with the plurality of metal areas of the lead frame through the vias, and

one or more conductive traces on the first surface of the plastic layer facing away from the lead frame and electrically insulated from the metal areas of the lead frame; and

at least one driver connected to the one or more lighting assemblies.

8. The lighting device as claimed in claim 7 , wherein the at least one point-like light source is directly connected on top of the lead frame, and a material, a shape and a size of the vias is adapted in order not to decrease the heat spread compared to the heat spread for the at least one point-like light source directly connected on top of the lead frame.

9. The lighting device as claimed in claim 7 , wherein the plastic layer is an overmolded plastic material.

10. The lighting device in accordance with claim 7 , wherein the one or more conductive traces on the first surface of the plastic layer are provided by using molded interconnect device (MID) technology.

11. The lighting device in accordance with claim 7 , wherein the one or more lighting assemblies comprise two lighting assemblies electrically coupled to the driver.

12. The lighting device in accordance with claim 7 , wherein the at least one point-like light source comprises two point-like light sources, each electrically coupled to one of the vias.

13. The lighting device in accordance with claim 7 , wherein the at least one point-like light source comprises one or more light-emitting diode (LED) devices.

14. A method of manufacturing a lighting assembly comprising:

providing a lead frame comprising a plurality of metal areas;

arranging a plastic layer at least on top of the lead frame in order to electrically insulate the lead frame from a first surface of the plastic layer that faces away from the lead frame with the plurality of metal areas of the lead frame exposed from the plastic layer such that a bottom surface of the plastic layer and a bottom surface of the metal areas form a bottom-most surface of the lighting assembly;

providing vias in the plastic layer;

completely filling each of the vias with an electrical conductive material;

providing the at least one point-like light source in direct contact with the first surface of the plastic layer and in direct contact with the electrical conductive material in the vias;

electrically and thermally connecting first and second electrical contacts of the at least one point-like light source to the metal areas of the lead frame by the vias;

providing conductive traces on the first surface of the plastic layer facing away from the lead frame; and

connecting at least one additional component to the conductive traces on the first surface of the plastic layer electrically insulated from the plurality of metal areas of the lead frame.

15. The method as claimed in claim 14 , wherein the providing the plastic layer on top of the lead frame comprises overmolding the lead frame with a plastic material.

16. The method as claimed in claim 14 , wherein the providing the conductive traces on the first surface of the plastic layer comprises:

covering the first surface of the plastic layer with a conductive layer; and

partly removing the conductive layer in regions where no conductive traces are to be placed.

17. The method as claimed in claim 16 , further comprising growing more conductive material on top of the conductive material to form thicker conductive traces.

18. The method in accordance with claim 17 , wherein the growing more conductive material comprises electro less plating the conductive traces.

19. The method in accordance with claim 16 , wherein the partly removing the conductive layer comprises using laser ablation to remove the conductive layers in the regions where no conductive traces are to be placed.