Semiconductor chip with transparent current spreading layer
A semiconductor chip may have a radiation-permeable support, a semiconductor body, and a transparent current spreading layer. The semiconductor body may have an n-sided semiconductor layer, a p-sided semiconductor layer, and an optically active area therebetween. The semiconductor body may be secured to the support by means of a radiation permeable connection layer. The current spread layer may be based on zinc selenide and may be adjacent to the n-sided semi-conductor layer. A method for producing this type of semiconductor chip is also disclosed.
1. A semiconductor chip comprising:
a radiation-transmissive carrier;
a semiconductor body fixed to the radiation-transmissive carrier by a radiation-transmissive connecting layer; wherein the semiconductor body comprises an n-side semiconductor layer, a p-side semiconductor layer, and an optically active zone located therebetween; and
a transparent current spreading layer comprising zinc selenide; wherein the transparent current spreading layer adjoins the n-side semiconductor layer; and
a further radiation-transmissive current spreading layer adjacent to the p-side semiconductor layer;
wherein the semiconductor chip is configured as a volume emitter, wherein electromagnetic radiation generated during operation of the semiconductor chip is configured to be coupled out via a front side, a rear side, and via side surfaces of the semiconductor chip.
2. The semiconductor chip according to claim 1 , wherein
the transparent current spreading layer is an n-side current spreading layer having a structured surface comprising out-coupling structures facing away from the radiation-transmissive carrier; and
the further radiation-transmissive current spreading layer is a p-side current spreading layer having a structured surface comprising out-coupling structures.
3. The semiconductor chip according to claim 2 , wherein the further radiation-transmissive current spreading layer comprises GaP; and wherein the semiconductor chip is free of a current spreading layer comprising AlGaAs or InAlP.
4. The semiconductor chip according to claim 1 , wherein the semiconductor body comprises a III-V semiconductor compound material and the semiconductor chip is free of a III-V growth substrate.
5. The semiconductor chip according to claim 1 , wherein the radiation-transmissive carrier comprises an electrically insulating material and has a front side facing away from the semiconductor body, the front side being free of electrical connections of the semiconductor chip.
6. The semiconductor chip according to claim 1 , wherein the semiconductor body comprises InGaP or InGaAlP; and wherein the semiconductor chip is free of a current spreading layer comprising InAlP.
7. The semiconductor chip according to claim 1 , wherein:
the further radiation-transmissive current spreading layer comprises GaP and adjoins the p-side semiconductor layer; and
the semiconductor chip is free of a current spreading layer comprising AlGaAs.
8. The semiconductor chip according to claim 1 , wherein the rear side faces away from the radiation-transmissive carrier, further comprising:
a contact layer on the rear side that is freely accessible;
a further contact layer arranged at least in regions between the semiconductor body and the radiation-transmissive carrier and adjoining the radiation-transmissive connecting layer; and
wherein the contact layer and the further contact layer are assigned to different electrical polarities of the semiconductor chip and are configured for electrically contacting the semiconductor body.
9. The semiconductor chip according to claim 1 , wherein the rear side faces away from the radiation-transmissive carrier and a through-via is configured for electrically contacting the n-side semiconductor layer, wherein
the transparent current spreading layer is arranged between the semiconductor body and the radiation-transmissive connecting layer, and
the through-via extends from the rear side throughout the p-side semiconductor layer and the optically active zone into the n-side semiconductor layer and is not in direct electrical contact with the transparent current spreading layer.
10. The semiconductor chip according to claim 1 , wherein the rear side faces away from the radiation-transmissive carrier and a through-via is configured for electrically contacting the n-side semiconductor layer, wherein
the transparent current spreading layer is arranged between the semiconductor body and the radiation-transmissive connecting layer; and
the through-via extends from the rear side throughout the p-side semiconductor layer, the optically active zone, and the n-side semiconductor layer; and wherein the through-via is not in direct electrical contact with the n-side semiconductor layer.
11. The semiconductor chip according to claim 1 , wherein the rear side faces away from the radiation-transmissive carrier and a through-via is configured for electrically contacting the p-side semiconductor layer, wherein
the semiconductor body is arranged between the transparent current spreading layer and the radiation-transmissive connecting layer, and
the through-via extends from the rear side throughout the transparent current spreading layer, the n-side semiconductor layer and the optically active zone.
12. The semiconductor chip according to claim 1 , further comprising an inner structured surface comprising out-coupling structures, wherein the inner structured surface is arranged between the active zone and the radiation-transmissive carrier.
13. The semiconductor chip according to claim 1 , wherein the transparent current spreading layer comprises at least one of the additional chemical elements selected from the group consisting of S, Cd, Mg, Be, or combinations thereof.
14. A component comprising a semiconductor chip according to claim 1 and a radiation transmissive encapsulation having a lower refractive index than the radiation-transmissive carrier; and wherein the semiconductor chip is encapsulated by the radiation transmissive encapsulation such that
the radiation-transmissive carrier is completely embedded within the enclosure; and
a contact layer on a rear side of the semiconductor chip configured for electrically contacting the semiconductor body, wherein the contact layer is at least partially free of the radiation transmissive encapsulation.
15. A method for producing a semiconductor chip comprising:
a radiation-transmissive carrier;
a semiconductor body fixed to the radiation-transmissive carrier by a radiation-transmissive connecting layer; wherein the semiconductor body comprises an n-side semiconductor layer, a p-side semiconductor layer, and an optically active zone located therebetween; and
a transparent current spreading layer comprising zinc selenide; wherein the transparent current spreading layer adjoins the n-side semiconductor layer;
wherein the method comprises:
providing a growth substrate;
applying the semiconductor body onto the growth substrate by a coating method; and
attaching the semiconductor body to the radiation-transmissive carrier by the radiation-transmissive connecting layer.
16. The method according to claim 15 , further comprising:
forming the p-side semiconductor layer, the n-side semiconductor layer, and the transparent current spreading layer on the growth substrate in the order given;
forming the transparent current spreading layer comprising an exposed surface that is structured before the radiation-transmissive carrier is attached to the semiconductor body; and
removing the growth substrate from the semiconductor body after the radiation-transmissive carrier is attached.
17. The method according to claim 15 , further comprising:
forming the n-side semiconductor layer and the p-side semiconductor layer on the growth substrate in the order given;
removing the growth substrate; and
forming the transparent current spreading layer on the n-side semiconductor layer.
18. The method according to claim 17 , further comprising mounting an auxiliary carrier on the semiconductor body prior to removing the growth substrate;
forming an exposed surface of the transparent current spreading layer,
mounting the radiation-transmissive carrier on the exposed surface of the current spreading layer; and
removing the auxiliary carrier from the semiconductor body.
19. The method according to claim 17 , further comprising:
forming a p-side current spreading layer on the p-side semiconductor layer prior to the removal of the growth substrate, wherein: the p-side current spreading layer has a structured surface comprising out-coupling structures;
mounting the radiation-transmissive carrier on the structured surface of the p-side current spreading layer;
removing the growth substrate to expose the n-side semiconductor layer; and
forming the transparent current spreading layer on an exposed n-side semiconductor layer.
20. The method according to claim 15 , wherein:
the semiconductor chip is configured as a volume emitter, wherein electromagnetic radiation generated during operation of the semiconductor chip is able to be coupled out via a front side, a rear side, and via side surfaces of the semiconductor chip;
the transparent current spreading layer is an n-side current spreading layer having a structured surface comprising out-coupling structures facing away from the radiation-transmissive carrier;
the semiconductor chip comprises a further radiation-transmissive current spreading layer, the further radiation-transmissive current spreading layer being adjacent to the p-side semiconductor layer and forming a p-side current spreading layer, and
the p-side current spreading layer has a structured surface comprising out-coupling structures.