IP Library Granted Patent US 11,307,087
Granted Patent B2
US 11,307,087 · App. 16/629,461 · Granted Apr 19, 2022

Optoelectronic modules with temperature-independent characteristics

Inventor: Jens Geiger (Thalwil, CH)
Assignee: ams Sensors Singapore Pte. Ltd.
G01J1/44G01S17/04H01L31/12H01S5/068H04R3/00G01J2001/444G01K7/02G01K7/22H01S5/183
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Quick Facts
Patent No.
US 11,307,087
App. No.
16/629,461
Granted
Apr 19, 2022
Kind
B2
Abstract

The present disclosure is directed to optoelectronic modules with substantially temperature-independent performance characteristics and host devices into which such optoelectronic modules can be integrated. In some instances, an optoelectronic module can collect proximity data using light-generating components and light-sensitive components that exhibit temperature-dependent performance characteristics. The light-generating components and light-sensitive components can be configured such that they exhibit complementing temperature-dependent performance characteristics such that the operating performance of the optoelectronic module is substantially temperature independent.

Claims (19)

1. An optoelectronic module operable to collect signals and being characterized by substantially temperature-independent performance characteristics, the module comprising:

a light-generating component operable to emit light, wherein the light-generating component exhibits temperature-dependent performance characteristics; and

a light-sensitive component operable to collect at least a portion of the light emitted by the light-generating component, wherein the light-sensitive component exhibits temperature-dependent performance characteristics;

wherein the temperature-dependent performance characteristics of the light-generating component and the temperature-dependent performance characteristics of the light-sensitive component complement each other such that the optoelectronic module exhibits substantially temperature-independent performance characteristics.

2. The optoelectronic module of claim 1 , wherein the light-sensitive component includes an optical component configured to complement the temperature-dependent performance characteristics of the light-generating component.

3. The optoelectronic module of claim 2 , wherein the optical component includes a dielectric material characterized by a thickness, wherein the thickness of the dielectric material is configured to complement the temperature-dependent performance characteristics of the light-generating component such that the optoelectronic module exhibits substantially temperature-independent performance characteristics.

4. The optoelectronic module of claim 1 , wherein the light-generating component includes a vertical-cavity surface-emitting laser.

5. The optoelectronic module of claim 4 , wherein the vertical-cavity surface-emitting laser is characterized by the temperature-dependent performance characteristics of the light-generating component, wherein the vertical-cavity surface emitting laser is configured to exhibit the temperature-dependent performance characteristics that complement the temperature-dependent performance characteristics of the light-sensitive component such that the optoelectronic module exhibits substantially temperature-independent performance characteristics.

6. The optoelectronic module of claim 5 , wherein the vertical-cavity surface-emitting laser is configured to exhibit a cavity mode shift and peak gain shift that complements the temperature-dependent performance characteristics of the light-sensitive component.

7. The optoelectronic module of claim 1 , wherein the light-generating component is characterized by an optical power that varies with the temperature-dependent performance characteristics of the light-sensitive component such that the optoelectronic module exhibit substantially temperature-independent performance characteristics.

8. The optoelectronic module of claim 7 , further comprising a thermistor or a thermocouple.

9. The optoelectronic module of claim 8 , wherein the thermistor or thermocouple is mounted adjacent to the light-sensitive component.

10. The optoelectronic module of claim 1 , further comprising a processor communicatively coupled to the light-sensitive component.

11. The optoelectronic module of claim 1 , wherein the light-sensitive component is any of: a photodiode, an array of charge-coupled devices, and/or an array of complementary metal-oxide semiconductor devices.

12. The optoelectronic module of claim 1 , wherein the light-generating component is any of: a vertical-cavity surface-emitting laser, another type of laser diode, and/or a light-emitting diode.

13. A host device including one or more optoelectronic modules as in claim 1 to collect signals and being characterized by substantially temperature-independent performance characteristics, the host device comprising a supplemental module configured to respond to signals collected by the one or more optoelectronic modules.

14. The host device of claim 13 , wherein the one or more optoelectronic modules includes a proximity sensor, the supplemental module includes a display screen, the signals collected by the proximity sensor includes signals corresponding to proximity data, and the response of the display screen includes altering the state of the display screen.

15. The host device of claim 13 , wherein the one or more optoelectronic modules includes a proximity sensor, the supplemental module includes an audio device, the signals collected by the proximity sensor includes signals corresponding to proximity data, and the response of the audio device includes altering the volume and/or sensitive of the audio device.

16. The host device of claim 15 , wherein the audio device incudes a speaker and/or a microphone.

Assignments (2)
CHANGE OF NAME Recorded Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2020
From: GEIGER, JENS
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 052947/0537 →