Sacrificial additively manufactured molds for use in injection molding processes
Sacrificial additively manufactured molds having a dissolvable material for use in thermoplastic injection molding processes at plastic melt temperatures in the range of 70-450 degrees C. and injection pressure in the range of 0.2-400 MPa. A method of producing a molded article using said sacrificial additively manufactured molds is also disclosed.
1. A sacrificial additively manufactured mold comprising a mold cavity enclosed by an outer shell, the mold cavity having an inlet and an outlet, and the outer shell consisting of a radiation-cured dissolvable material which (a) in its uncured form is a selectively-curable resin or mixture of resins, and (b) when cured can withstand plastic melt temperatures in the range of 70-450 degrees C. and injection pressures in the range of 0.2-400 MPa when formed as said outer shell, wherein the radiation-cured dissolvable material is additively manufactured to create the sacrificial additively manufactured mold.
2. The sacrificial additively manufactured mold according to claim 1 , wherein the radiation-cured dissolvable material is a radiation-cured dissolvable resin formulation comprising a curing agent and at least one of 4-(1-oxo-2-propenyl)-morpholine, trimethylolpropane(EO)9 triacrylate, polyethylene glycol 200 diacrylate, sucrose benzoate, modified acrylate polyester and modified acrylate polyethylene polyol.
3. The sacrificial additively manufactured mold according to claim 2 , wherein the curing agent is an ultraviolet (UV) curable agent.
4. The sacrificial additively manufactured mold according to claim 2 , wherein the radiation-cured dissolvable resin formulation further comprises a stabilizing agent.
5. The sacrificial additively manufactured mold according to claim 2 , wherein the radiation-cured dissolvable resin formulation further comprises an ultraviolet (UV) blocking agent.
6. The sacrificial additively manufactured mold according to claim 2 , wherein the radiation-cured dissolvable resin formulation further comprises an agent capable of promoting a thermal post-curing of the mold selected from the group consisting of epoxies, blocked isocyanates and powdered aluminum.
7. A sacrificial additively manufactured mold comprising a mold cavity enclosed by an outer shell, the mold cavity having an inlet and an outlet, and the outer shell consisting of a radiation-cured dissolvable material which (a) in its uncured form is a selectively-cured resin or mixture of resins, and (b) when cured can withstand plastic melt temperatures in the range of 70-450 degrees C. and injection pressures in the range of 0.2-400 MPa, wherein the radiation-cured dissolvable material is additively manufactured to create the sacrificial additively manufactured mold, wherein the radiation-cured dissolvable material includes a polymer having cross-linked structures that are soluble.
8. The sacrificial additively manufactured mold according to claim 7 , wherein the radiation-cured dissolvable material is a radiation-cured dissolvable resin formulation comprising a curing agent and at least one of 4-(1-oxo-2-propenyl)-morpholine, trimethylolpropane(EO)9 triacrylate, polyethylene glycol 200 diacrylate, sucrose benzoate, modified acrylate polyester and modified acrylate polyethylene polyol.
9. The sacrificial additively manufactured mold according to claim 8 , wherein the curing agent is an ultraviolet (UV) curable agent.
10. The sacrificial additively manufactured mold according to claim 8 , wherein the radiation-cured dissolvable resin formulation further comprises a stabilizing agent.
11. The sacrificial additively manufactured mold according to claim 8 , wherein the radiation-cured dissolvable resin formulation further comprises an ultraviolet (UV) blocking agent.
12. The sacrificial additively manufactured mold according to claim 8 , wherein the radiation-cured dissolvable resin formulation further comprises an agent capable of promoting a thermal post-curing of the mold selected from the group consisting of epoxies, blocked isocyanates and powdered aluminum.