Method of producing an optoelectronic component

1. A method of manufacturing an optoelectronic component comprising:

providing a carrier with an upper side;

arranging an optoelectronic semiconductor chip above the upper side of the carrier;

arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface;

simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles comprises a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

2. The method as claimed in claim 1 , further comprising, before spraying on the particles, introducing a substance into the casting material, wherein the substance is configured to prevent the particles to be sprayed onto the cast surface from sinking into the casting material.

3. The method as claimed in claim 1 , further comprising, before spraying on the particles, partially hardening the casting material.

4. The method as claimed in claim 1 , further comprising, after spraying on the particles, hardening the casting material.

5. The method as claimed in claim 1 , further comprising, after spraying on the particles, removing unbonded or weakly bonded particles at the cast surface.

6. The method as claimed in claim 1 , wherein a thickness of the further material after spraying the further material onto the cast surface is smaller than an average diameter of the particles.

7. The method as claimed in claim 1 , wherein the casting material comprises further particles.

8. The method as claimed in claim 1 , wherein the casting material comprises a wavelength-converting fluorescent material.