Method of producing an optoelectronic component
A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
1. A method of manufacturing an optoelectronic component comprising:
providing a carrier with an upper side;
arranging an optoelectronic semiconductor chip above the upper side of the carrier;
arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and
removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
2. The method as claimed in claim 1 , wherein before removal of a portion of the casting material at the cast surface the casting material is hardened.
3. The method as claimed in claim 1 , wherein the casting material comprises embedded particles.
4. The method as claimed in claim 3 , wherein particles are exposed by removal of a portion of the casting material at the cast surface.
5. The method as claimed in claim 3 , wherein particles are released from the casting material when a portion of the casting material at the cast surface is removed.
6. The method as claimed in claim 1 , wherein the casting material comprises a wavelength-converting fluorescent material.