Optoelectronic semiconductor chip, high-voltage semiconductor chip and method for producing an optoelectronic semiconductor chip
An optoelectronic semiconductor chip may include a semiconductor layer sequence having at least one n-doped semiconductor layer, at least one p-doped semiconductor layer, and an active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. A p-terminal contact may be electrically contacted to the p-doped semiconductor layer. An n-terminal contact may be electrically contacted to the n-doped semiconductor layer. The n-terminal contact may be arranged in direct contact with the p-doped semiconductor layer at least in regions.
1. An optoelectronic semiconductor chip, comprising
a semiconductor layer sequence comprising at least one n-doped semiconductor layer, at least one p-doped semiconductor layer, and an active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer;
a p-terminal contact electrically contacting the p-doped semiconductor layer;
an n-terminal contact electrically contacting the n-doped semiconductor layer;
wherein the n-terminal contact is arranged in direct contact with the p-doped semiconductor layer at least in regions; and
a first dielectric mirror element is arranged in regions between the p-doped semiconductor layer and the n-terminal contact.
2. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the n-terminal contact is arranged in direct contact with a first trench and the active layer.
3. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the n-terminal contact is metallic and is arranged at least in regions over the p-doped semiconductor layer and the n-doped semiconductor layer,
wherein the n-terminal contact and the p-doped semiconductor layer are electrically separated by a first dielectric mirror element except at least in one region of the first trench in which the n-terminal contact is arranged in direct contact with the p-doped semiconductor layer.
4. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the semiconductor chip comprises at least one first trench, wherein the n-terminal contact extends inside the first trench, wherein the n-terminal contact is arranged in direct mechanical contact with the p-doped semiconductor layer inside the first trench.
5. The optoelectronic semiconductor chip as claimed in claim 1 ,
which if applicable comprises a second dielectric mirror element,
wherein the first dielectric mirror element and/or a second dielectric mirror element is configured as a distributed Bragg reflector.
6. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the first trench comprises a partial sidewall which makes having an angle a of less than 70° with the n-doped semiconductor layer.
7. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the first trench comprises a partial sidewall having an angle a of less than 60° or less than 45° with the n-doped semiconductor layer.
8. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein a current spreading structure is arranged between the p-terminal contact and the first dielectric mirror element or a second dielectric mirror element,
wherein the current spreading structure extends over the p-doped semiconductor layer and the first dielectric mirror element or the second dielectric mirror element.
9. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the first dielectric mirror element and/or a second dielectric mirror comprises regions formed in the shape of islands arranged in direct contact with the p-doped semiconductor layer.
10. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein, as seen in lateral cross section, the first dielectric mirror element and/or a second dielectric mirror element has a smaller or larger lateral extent than the first trench and/or a second trench.
11. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein a further current spreading structure is arranged between the p-terminal contact and a second dielectric mirror element,
wherein the further current spreading structure extends over the p-doped semiconductor layer and the second dielectric mirror element, wherein the current spreading structure is arranged between the second dielectric mirror element and the p-doped semiconductor layer.
12. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the first and/or second dielectric mirror element comprises at least one of the materials Al 2 O 3 , Ta 2 O 5 , ZrO 2 , ZnO, SiN X , SiO X N y , SiO 2 , TiO 2 , ZrO 2 , HfO 2 , Nb 2 O 5 , MgF 2 , or combinations thereof.
13. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein the first dielectric mirror element and/or second dielectric mirror element comprises a layer sequence having alternating layers of SiO 2 and TiO 2 or SiO 2 and Nb 2 O 5 .
14. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein a direct current flow between the p-terminal contact or n-terminal contact and the p- and n-doped semiconductor layers and the active layer is prevented by the first dielectric mirror element and/or a second dielectric mirror element.
15. The optoelectronic semiconductor chip as claimed in claim 1 ,
wherein a second dielectric mirror element is arranged between the p-terminal contact and the p-doped semiconductor layer, wherein a current spreading structure is arranged over the p-doped semiconductor layer, wherein the current spreading structure is at least in regions opened in the region of the p-terminal contact.
16. A high-voltage semiconductor chip comprising at least two optoelectronic semiconductor chips as claimed in claim 1 .
17. A method for producing an optoelectronic semiconductor chip as claimed in claim 1 , wherein the method comprises:
providing a semiconductor layer sequence having at least one first trench comprising at least one n-doped semiconductor layer, at least one p-doped semiconductor layer, and an active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer;
providing a first dielectric mirror element and etching a first trench, the first trench being adapted to receive an n-terminal contact which electrically contacts the n-doped semiconductor layer;
applying the n-terminal contact at least in regions onto the n-doped semiconductor layer and onto the p-doped semiconductor layer, the n-terminal contact being arranged in direct contact with the p-doped semiconductor layer at least in regions, and the n-terminal contact if applicable being arranged in direct contact with a first trench and the active layer.