IP Library Granted Patent US 11,592,340
Granted Patent B2
US 11,592,340 · App. 16/634,666 · Granted Feb 28, 2023

Circuit device and temperature detection system

Inventors: Shinya Nakano (Hyogo, JP); Yoshitaka Ishikawa (Hyogo, JP); Kenji Koizumi (Kanagawa, JP); Chikara Ohmori (Osaka, JP); Naohisa Morimoto (Osaka, JP)
Assignees: SANYO Electric Co., Ltd.; PANASONIC HOLDINGS CORPORATION
G01K7/22G01K7/24H04B15/00
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Quick Facts
Patent No.
US 11,592,340
App. No.
16/634,666
Granted
Feb 28, 2023
Kind
B2
Abstract

A circuit device that is connected to a temperature detection element that detects a temperature of an object via an external signal line and an external signal ground line includes a connector that is connected to the external signal line and the external signal ground line, an internal signal line that is connected to the external signal line via the connector, an internal signal ground line that is connected to the external signal ground line via the connector, a controlling circuit that is connected to the internal signal line and the internal signal ground line and detects the temperature of the object, and a high-frequency filter that is inserted into at least one of a foremost stage of the internal signal line and a foremost stage of the internal signal ground line as viewed from the connector.

Claims (32)

1. A circuit device for being connected to a temperature detection element that detects a temperature of an object via an external signal line and an external signal ground line, the circuit device comprising:

a connector that is connected to the external signal line and the external signal ground line;

an internal signal line that is connected to the external signal line via the connector;

an internal signal ground line that is connected to the external signal ground line via the connector;

a controlling circuit that is connected to the internal signal line and the internal signal ground line and detects the temperature of the object;

a high-frequency filter that is inserted into at least one of a foremost stage of the internal signal line and a foremost stage of the internal signal ground line as viewed from the connector; and

a low-pass filter including a resistor and a capacitor each connected to the high-frequency filter and the controlling circuit;

wherein the external signal line and the external signal ground line each include a wire harness connected to the connector.

2. The circuit device according to claim 1 , wherein

the high-frequency filter is disposed near the connector.

3. The circuit device according to claim 1 , wherein

the high-frequency filter is a chip bead.

4. The circuit device according to claim 1 , wherein

the high-frequency filter is a damping resistor.

5. The circuit device according to claim 1 , wherein

the internal signal line includes a strip line or a microstrip line, and

the internal signal ground line includes a ground plane.

6. A temperature detection system comprising:

a temperature detection element that detects a temperature of an object;

an external signal line that is connected to one end of the temperature detection element;

an external signal ground line that is connected to another end of the temperature detection element; and

a circuit device that is connected to the temperature detection element via the external signal line and the external signal ground line,

wherein

the circuit device includes:

a connector that is connected to the external signal line and the external signal ground line;

an internal signal line that is connected to the external signal line via the connector;

an internal signal ground line that is connected to the external signal ground line via the connector;

a controlling circuit that is connected to the internal signal line and the internal signal ground line and detects the temperature of the object;

a high-frequency filter that is inserted into at least one of a foremost stage of the internal signal line and a foremost stage of the internal signal ground line as viewed from the connector; and

a low-pass filter including a resistor and a capacitor each connected to the high-frequency filter and the controlling circuit;

wherein the external signal line and the external signal ground line each include a wire harness connected to the connector.

7. The temperature detection system according to claim 6 , further comprising a capacitor that is connected in parallel to the temperature detection element.

Assignments (2)
CHANGE OF NAME Recorded May 12, 2022
From: PANASONIC CORPORATION
To: PANASONIC HOLDINGS CORPORATION
Reel/Frame 060054/0248 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2020
From: NAKANO, SHINYA; ISHIKAWA, YOSHITAKA; KOIZUMI, KENJI; OHMORI, CHIKARA; MORIMOTO, NAOHISA
To: SANYO ELECTRIC CO., LTD.; PANASONIC CORPORATION
Reel/Frame 051972/0487 →
Priority Claims (1)
JP JP2017-151645 · Aug 4, 2017 · national
Continuity (1)
Related Publication 20210126333A1 · Apr 29, 2021