IP Library Granted Patent US 11,367,855
Granted Patent B2
US 11,367,855 · App. 16/634,680 · Granted Jun 21, 2022

Display panel and display device each having solidification inhibiting layer surrounding each spacer inhibiting spreading of sealant to the spacers and method of manufacturing the display panel

Inventor: Donghui Yu (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L51/525H01L51/5246H01L51/56
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,367,855
App. No.
16/634,680
Granted
Jun 21, 2022
Kind
B2
Abstract

A display panel and a method of manufacturing the same, a display device are provided. The display panel includes a first substrate and a second substrate disposed oppositely to each other, and a sealant, spacers and a solidification inhibiting layer arranged between the first substrate and the second substrate, the solidification inhibiting layer being provided between the sealant and the spacers, and configured to inhibit the spreading of the sealant to the spacer.

Claims (22)

1. A display panel, comprising

a first substrate and a second substrate provided oppositely to each other, and

a sealant, spacers, and a solidification inhibiting layer between the first substrate and the second substrate;

wherein the solidification inhibiting layer is provided between the sealant and each of the spacers, and is configured to surround each of the spacers to inhibit spreading of the sealant to the spacers, and the sealant includes an epoxy-based organic material, and the solidification inhibiting layer includes at least one of sodium ions and potassium ions.

2. A method of manufacturing a display panel, comprising,

providing a first substrate and a second substrate;

forming a first electrode layer on the first substrate;

forming spacers on the second substrate;

forming an auxiliary electrode layer to cover the second substrate;

forming a solidification inhibiting layer around each of the spacers;

applying a sealant onto the first substrate or the second substrate;

arranging the first substrate and the second substrate to be opposite to each other, so that the sealant, first electrode layer, the auxiliary electrode layer, the spacers and the solidification inhibiting layer are sandwiched between the first substrate and the second substrate;

curing the sealant, wherein the solidification inhibiting layer is formed on the first electrode layer or on the auxiliary electrode layer and between the sealant and each of the spacers, and the solidification inhibiting layer is configured to surround each of the spacers to inhibit spreading of the sealant to the spacers, and the sealant includes an epoxy-based organic material, and the solidification inhibiting layer includes at least one of sodium ions and potassium ions.

3. The manufacturing method according to claim 2 , further comprising,

curing the sealant with ultraviolet light before the first substrate and the second substrate are arranged oppositely to each other.

4. The manufacturing method according to claim 3 , further comprising,

thermally curing the sealant, after the first substrate and second substrate are arranged oppositely to each other.

5. The manufacturing method according to claim 2 ,

wherein the first substrate and the second substrate are arranged to be opposite to each other, so that the spacers electrically connect the auxiliary electrode layer and the first electrode layer.

6. The manufacturing method according to claim 5 , wherein the spacers and the solidification inhibiting layer are formed on one side of the first electrode layer away from the first substrate, the spacers are in contact with the first electrode layer and are electrically conductive, and after the first substrate and the second substrate are arranged oppositely to each other, one end of each spacer away from the first electrode layer contacts the auxiliary electrode layer; or

the spacers and the solidification inhibiting layer are formed on one side of the auxiliary electrode layer away from the second substrate, each of the spacers contacts the auxiliary electrode layer and is electrically conductive, and after the first substrate and the second substrate are arranged oppositely to each other, each of the spacers contacts the first electrode layer; or

the spacers are formed on the second substrate, next the auxiliary electrode layer is formed on the spacers, the solidification inhibiting layer is then formed on the auxiliary electrode layer, and after the first substrate and the second substrate are arranged oppositely to each other, a part of the auxiliary electrode layer overlapping with each of the spacers protrudes toward the first substrate to be electrically connected with the first electrode layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2023
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 064397/0480 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2020
From: YU, DONGHUI
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 051641/0328 →
Priority Claims (1)
CN 201810862110.7 · Aug 1, 2018 · national
Continuity (1)
Related Publication 20210217983A1 · Jul 15, 2021